Method for making micromachine moving piece and metal intraconnection thereof

[0017] Please refer to Figure 1 to Figure 13 . Figure 1 to Figure 13 It is a schematic diagram of a method for manufacturing a micromechanical moving part and its metal interconnection in a preferred embodiment of the present invention. like figure 1 As shown, firstly, a substrate 10 is provided, such as a semiconductor wafer, wherein the substrate 10 may include electronic components (not shown) that have been fabricated and are to be subjected to a metal interconnection process. Next, a thermal oxide layer 12 is formed on the surface of the substrate 10 to serve as a stress buffer layer and a diffusion barrier layer for preventing subsequent metal interconnections from diffusing. In other embodiments of the present invention, the thermal oxide layer 12 may not be formed on the surface of the substrate 10 as required.

[0018] like figure 2 As shown, a seed layer 14 is subsequently formed on the surface of the thermal oxide layer 12 . The seed layer 14 can be formed by sp