Measuring butt point method for measuring base plate size in base plate technology

A measurement and substrate technology, applied in multi-layer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve problems affecting process yield, changing dimensions, reducing alignment accuracy of circuit layers and through holes, etc., to increase Production cost, effect of increasing accuracy

Active Publication Date: 2008-09-10
ASE ELECTRONICS
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  • Summary
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  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present in this patented technology allows for accurate measurements on small objects such as semiconductor wafers while also improving their production efficiency by allowing them to quickly measure its sizes accurately without adding extra steps or increasing costs compared with existing methods that require multiple steps.

Problems solved by technology

Technological Problem: Current techniques used during production require that each individual component be aligned accurately with its own position when it comes into contact with another surface before being assembled together. Additionally, current processes often involve multiple steps such as creation of an intermediate material called Hard Base Layer (HBL), followed by building up the necessary circuitry onto HBL's. These changes can cause variations in device dimensions caused by temperature effects or other environmental variables like humidity.

Method used

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  • Measuring butt point method for measuring base plate size in base plate technology
  • Measuring butt point method for measuring base plate size in base plate technology
  • Measuring butt point method for measuring base plate size in base plate technology

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Embodiment Construction

[0038] FIG. 1 illustrates a method for measuring the size of a substrate by measuring target points on the substrate according to an embodiment of the present invention.

[0039] Referring to FIG. 1 , the substrate 100 of the present invention has a plurality of measurement targets 110 , and the measurement targets 110 can be arbitrarily arranged at appropriate positions on the substrate 100 . In this embodiment, for example, the measurement target points 110 are formed at the four corners of the substrate 100, wherein the measurement target points 110 can measure the size of the substrate 100 in real time during the manufacturing process of the substrate 100, which facilitates To increase the accuracy of process alignment. Generally speaking, the method for measuring the size of the substrate of the present invention can be calculated by measuring the inner diameter D of the target point 110 and the distances H1, H2, H3, and H4 between the center points 112 of the target point 1

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Abstract

The invention relates to a target measuring method formed in the base plate technique for measuring the size of a base plate. Firstly, a board is provided, which comprises a base layer and a conductive layer, and the conductive layer is arranged on a surface of the base layer in a matching way. Secondly, at least one through hole is formed on the board so as to act as a measuring target for measuring the size of the base plate. Then, a plated through hole is formed in the through hole so as to act as a measuring target for measuring the size of the base plate for another time. After the above steps, a pattern dielectric layer is formed on the board, and the pattern dielectric layer is exposed outside the plated through hole so as to act as a measuring target for measuring the size of the base plate for the next time. The method can form a measuring target in the base plate technique and can carry out real-time measurement to the size of a base plate, thereby requiring no additional manufacture cost and facilitating increasing the contraposition accuracy of the technique.

Description

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Claims

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Application Information

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Owner ASE ELECTRONICS
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