Junction field-effect transistor (JFET) pipe compatible process with double pole and P-ditch aligning automatically

A self-alignment and process technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as large parasitic capacitance and large manufacturing process deviation, and achieve large dynamic resistance, good consistency, offset and leakage. The effect of low current

Active Publication Date: 2013-02-06
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the defects of large gate-source/drain overlapping parasitic capacitance and large manufacturing process d

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0041] First, the substrate is selected as P type 4-inch silicon wafer, resistivity (8-13)Ω.cm, thickness (525±20)μm; then clean the substrate: the silicon wafer needs to be chemically cleaned, and the cleaning chemicals are concentrated sulfuric acid and hydrogen peroxide And hydrofluoric acid. Concentrated sulfuric acid and hydrogen peroxide are strong oxidants, which can remove particles or dust on the surface of silicon wafers. In the process of boiling concentrated sulfuric acid, a natural oxide layer will be formed on the surface of the silicon wafer, which needs to be rinsed and corroded with hydrofluoric acid, rinsed with high-purity deionized water, and centrifuged under nitrogen protection.

[0042] Proportion of chemical reagents and ambient temperature:

[0043] Sulfuric acid: hydrogen peroxide=3:1 temperature is (115±5)℃

[0044] Hydrofluoric acid: water = 1:30 temperature is room temperature

[0045] The resistivity of deionized water is ≥18MΩ.cm.

[0046] The invention p

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PUM

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Abstract

The invention relates to a junction field-effect transistor (JFET) pipe compatible process with a double pole and a P-ditch aligning automatically. By means of grid region pre-oxidation, ditch region boron filling, grid region phosphorus filling and the annealing process, a method for manufacturing a double pole and grid self-aligning P-ditch JEFT compatible integrated amplifier is achieved. By means of the JEFT pipe compatible process, the shortcomings that a grid source/leakage overlapping parasitic capacitance formed by the existing non-self-aligning grid is large, a source end resistor and the drift region length are both large, and the device depends on graph dimension and dosage concentration of the ditch region and the drift region are overcome. The P-ditch JFET pipe process with the grid aligning automatically has the advantages of achieving self aligning of the grid region and the source/leak region, and reducing the drift region length of the grid source/leak overlapping parasitic capacitance and the source end resistance and the leakage end; and the P-ditch JEFT pipe is large in output dynamic resistance and, good in consistency of transconductance and punch-off voltage, and small in detuning and leakage current.

Description

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Claims

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Application Information

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Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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