Junction field-effect transistor (JFET) pipe compatible process with double pole and P-ditch aligning automatically
A self-alignment and process technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as large parasitic capacitance and large manufacturing process deviation, and achieve large dynamic resistance, good consistency, offset and leakage. The effect of low current
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[0041] First, the substrate is selected as P type 4-inch silicon wafer, resistivity (8-13)Ω.cm, thickness (525±20)μm; then clean the substrate: the silicon wafer needs to be chemically cleaned, and the cleaning chemicals are concentrated sulfuric acid and hydrogen peroxide And hydrofluoric acid. Concentrated sulfuric acid and hydrogen peroxide are strong oxidants, which can remove particles or dust on the surface of silicon wafers. In the process of boiling concentrated sulfuric acid, a natural oxide layer will be formed on the surface of the silicon wafer, which needs to be rinsed and corroded with hydrofluoric acid, rinsed with high-purity deionized water, and centrifuged under nitrogen protection.
[0042] Proportion of chemical reagents and ambient temperature:
[0043] Sulfuric acid: hydrogen peroxide=3:1 temperature is (115±5)℃
[0044] Hydrofluoric acid: water = 1:30 temperature is room temperature
[0045] The resistivity of deionized water is ≥18MΩ.cm.
[0046] The invention p
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