Method for covering preformed soldering lug on chip sealing cover plate

A preformed solder piece and sealing cover technology, which is applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of welding influence, performance and shape change, and low production efficiency between the sealing cover and the lower shell. Achieve the effect of high reliability, convenient processing and cost saving

Inactive Publication Date: 2013-04-10
汕尾市栢林电子封装材料有限公司
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] The method of covering the preform of gold-tin alloy on the cover plate, such as the invention patent with the publication number "CN1556544A" and the name "Preparation Method of Hermetic Packaging Cover Plate for Integrated Circuits", is to solder the preform of gold-tin alloy The sheet is welded to the sealing cover by spot welding, but this spot welding method is not stable enough and easy to fall off, and a spot welding machine is required, which increases additional costs and low production efficiency
In the utility mo

Method used

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[0016] In order to facilitate the understanding of those skilled in the art, the composition principle of the present invention will be further described in detail below in conjunction with specific embodiments and drawings:

[0017] The method of the present invention utilizes the characteristic that the melting point of the AuSn alloy pre-formed solder sheet is higher than that of pure tin, and the AuSn alloy pre-formed solder sheet is firmly covered on the sealing cover by adding tin and performing reflow soldering at an appropriate temperature. AuSn alloy solder preforms generally refer to alloy materials with 80% Au and 20% Sn by weight, and are pre-formed into solder plates. Generally, the contact between the sealing cover sheet and the shell is only at the periphery. Therefore, the pre-formed welding sheet of AuSn alloy is generally made of a hollow welding sheet corresponding to the peripheral shape of the sealing cover sheet.

[0018] Such as figure 1 The specific steps of t

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Abstract

The invention discloses a method for covering a preformed soldering lug on a chip sealing cover plate. The method comprises the following steps of firstly tinning the surface of an Au-Sn alloy preformed soldering lug; and downwards putting the tinned surface of the An-Sn alloy preformed soldering lug after the tinning on a sealing cover plate of which the surface is gilded, carrying out reflow soldering under the condition of 232-280 DEG C, and enabling the Au-Sn alloy preformed soldering lug to be fixedly connected with the sealing cover plate. The thickness of a tinned Sn layer is less than or equal to 1.5 times of that of a gilded Au layer of the sealing cover plate. Compared with the method used in the prior art, the chip sealing cover plate and the preformed soldering lug are firmly combined, and the reliability is high; and the method disclosed by the invention has the advantages that processing is convenient, the efficiency is high, an additional device is not needed, and the cost is saved.

Description

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Claims

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Application Information

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Owner 汕尾市栢林电子封装材料有限公司
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