Method for electroplating goldfinger with thick gold layer

[0028] This embodiment provides a gold finger electroplating method with a gold layer thickness of 32 microinches, including the following steps:

[0029] A method for electroplating gold fingers, comprising the following steps:

[0030] a. Use the copper clad laminate to etch the outer layer circuit and form a gold finger lead;

[0031] b. Applying the covering to form the gold-plated finger area;

[0032] c. Electroplating a nickel layer on the gold-plated finger area;

[0033] d. electroplating a gold layer on the nickel layer in the gold-plated finger area;

[0034] e. Remove gold fingers and prevent soldering;

[0035] Above-mentioned procedure c is to use nickel sulfamate electroplating solution to electroplate nickel on the gold-plated finger area; above-mentioned nickel sulfamate electroplating solution is the mixed solution that is made up of 400g / L nickel sulfamate, 30g / L boric acid and 40g / L nickel chloride.

[0036] In this embodiment, the above-mentioned co

[0044] This embodiment provides a gold finger electroplating method with a thick gold layer of 35 microinches, including the following steps:

[0045] a. Use the copper clad laminate to etch the outer layer circuit and form a gold finger lead;

[0046] b. Applying the covering to form the gold-plated finger area;

[0047] c. Electroplating a nickel layer on the gold-plated finger area;

[0048] d. electroplating a gold layer on the nickel layer in the gold-plated finger area;

[0049] e. Remove gold fingers and prevent soldering;

[0050] Above-mentioned procedure c is to use nickel sulfamate electroplating solution to electroplate nickel on the gold-plated finger area; above-mentioned nickel sulfamate electroplating solution is the mixed solution that is made up of 600g / L nickel sulfamate, 50g / L boric acid and 70g / L nickel chloride.

[0051] In this embodiment, the above-mentioned covering is selective ink.

[0052] The electroplated nickel layer in the above step c is