Method for measuring physical yielding point position and stress level of component

A technology of stress level and measurement method, applied in the direction of applying stable tension/pressure to test the strength of materials, measuring devices, instruments, etc., can solve the problem that the performance of component points is difficult to give detailed results, so as to improve the overall performance, Good practicality, easy to use effect

Inactive Publication Date: 2018-11-13
AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the characteristics of the general static load tensile test instrument, it only records the overall stress-strain curve of the component, which gives sufficient mechanical

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0031] Example 1

[0032] A method for determining the physical yield point position and stress level of a member. In the process of static load tensile test, infrared thermal imaging of the member is taken, and based on the synchronized load and member temperature field data, the physical yield point position and stress level of the thin plate member are determined. Stress levels are accurately measured.

[0033] Further, the first step is to design and manufacture the components. In addition to the national standards, the component design should also reduce heat loss, such as using hole components to reduce the heat loss caused by clamping; the second step, in the static load tension The conventional tensile test is carried out on the tensile machine, and the infrared thermal image of the component is photographed and recorded during the whole test process, and the shooting speed is higher than the sampling speed selected for the static load tensile test; the third step is base

Example Embodiment

[0036] Example 2

[0037] A method for determining the physical yield point position and stress level of a member. In the process of static load tensile test, infrared thermal imaging of the member is taken, and based on the synchronized load and member temperature field data, the physical yield point position and stress level of the thin plate member are determined. Stress levels are accurately measured.

[0038]Further, the first step is to design and manufacture the components. In addition to the national standards, the component design should also reduce heat loss, such as using hole components to reduce the heat loss caused by clamping; the second step, in the static load tension The conventional tensile test is carried out on the tensile machine, and the infrared thermal image of the component is photographed and recorded during the whole test process, and the shooting speed is higher than the sampling speed selected for the static load tensile test; the third step is based

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Abstract

The invention provides a method for measuring the physical yielding point position and the stress level of a component. The method is technically characterized in that thermal image shooting is performed on the component in the static load tension test process, and the physical yielding point position and the stress level of the thin-plate component are accurately measured based on synchronous load and component temperature field data. Relatively accurate physical yielding point position and stress can be acquired, and more accurate mechanical property reference data are provided for welding joint design and performance evaluation. As the position firstly with yielding is the weakest position in a structure, the method can be applied to structural static load test to accurately locate theweak position, overall performances are improved for design, and the problem of insufficient precision of a current macroscopic shielding strength measuring method based on a stress-strain curve is solved. The method is simple to use, easy to implement and excellent in practicability, and original static load tension test is not changed.

Description

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Claims

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Application Information

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Owner AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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