Inner-layer board high-vacuum continuous laminating device and method for PCB (Printed Circuit Board) circuit process

A pressing device and inner layer board technology, applied in lamination devices, lamination, chemical instruments and methods, etc., can solve the problems of low efficiency, long heating and cooling time, long waiting time for pressing, etc., and achieve continuous Pressing and improving the effect of pressing efficiency

Pending Publication Date: 2021-08-13
江西旭昇电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing process has the following disadvantages: the heating and cooling

Method used

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[0029] In order to better understand the technical solutions in the embodiments of the present invention, the above objects, features and advantages of the present invention can be further understood, and the specific embodiments of the present invention will be further understood in connection with the accompanying drawings. instruction.

[0030] It should be noted herein to help understand the present invention, but is not intended to be limited to the present invention. Further, the technical features according to each of the embodiments described below, can be combined with each other as long as they do not constitute a conflict between each other.

[0031] Please refer to figure 1 and figure 2 , figure 1 It is a schematic diagram of a high vacuum continuous pressing device of the inner layer plate provided by the PCB line process according to the present invention; figure 2 Yes figure 1 A structural diagram of another angle of the inner laminate high vacuum continuous pressing d

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Abstract

The invention discloses an inner-layer board high-vacuum continuous pressing device for a PCB (Printed Circuit Board) circuit process, which comprises a feeding bin, a continuous pressing bin and a discharging bin which are connected in sequence, as well as a vacuum pump unit and a display control device. A to-be-pressed board assembly is conveyed through a feeding and discharging trolley and sequentially passes through the feeding bin, the continuous pressing bin and the discharging bin till the pressing process is completed. The vacuum pump unit is connected with the feeding bin, the continuous pressing bin and the discharging bin. The interior of the continuous pressing bin is in a vacuum state during working, and the pressure states of the feeding bin and the discharging bin are adjusted according to corresponding working requirements. According to the inner-layer board high-vacuum continuous pressing device for the PCB circuit process, continuous pressing of the inner-layer board of the PCB circuit can be achieved, and the pressing efficiency is improved. Based on the pressing device, the invention further provides an inner-layer board high-vacuum continuous pressing method for the PCB circuit process.

Description

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Claims

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Application Information

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Owner 江西旭昇电子有限公司
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