Silicon carbide ceramic wave-absorbing pyramid based on 3D printing and preparation method thereof

A silicon carbide ceramic, 3D printing technology, applied in ceramic molding machines, manufacturing tools, additive processing, etc., can solve problems such as inability to meet test requirements, and achieve the effect of saving sintering costs, diversifying shape and structure, and high development efficiency

Pending Publication Date: 2022-04-12
CHANGPING BEIJING ELECTROMAGNETIC PROTECTION
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the increasing demand for high-power testing, for ultra-high-power radar testing, the power density on the absorbing material may reach tens of kilowatts per square meter or even

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon carbide ceramic wave-absorbing pyramid based on 3D printing and preparation method thereof
  • Silicon carbide ceramic wave-absorbing pyramid based on 3D printing and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Example 1: The silicon carbide ceramic wave-absorbing pyramid includes a silicon carbide wave-absorbing mixed powder and a polymer binder, and the silicon carbide wave-absorbing mixed powder includes: SiC 25% to 45%, BaTiO 3 4%~9%, MnO 2 2%~6%, MgO 1%~3%, Al 2 o 3 2%~6%, Y 2 o 3 2% to 6%, and the remaining ingredients are polymer binders.

Embodiment 2

[0035] Embodiment 2: The silicon carbide ceramic wave-absorbing pyramid includes silicon carbide wave-absorbing mixed powder and polymer binder, and the silicon carbide wave-absorbing mixed powder includes: SiC 25%, BaTiO 3 4%, MnO 2 2%, MgO 1%, Al 2 o 3 2%, Y 2 o 3 2%, and the remaining ingredients are polymer binders.

Embodiment 3

[0036]Embodiment 3: The silicon carbide ceramic wave-absorbing pyramid includes silicon carbide wave-absorbing mixed powder and polymer binder, and the silicon carbide wave-absorbing mixed powder includes: SiC 45%, BaTiO 3 9%, MnO 2 6%, MgO 3%, Al 2 o 3 6%, Y 2 o 3 6%, and the remaining ingredients are polymer binders.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Heightaaaaaaaaaa
Login to view more

Abstract

The invention discloses a silicon carbide ceramic wave-absorbing pyramid based on 3D printing and a preparation method of the silicon carbide ceramic wave-absorbing pyramid based on 3D printing, silicon carbide wave-absorbing mixed powder and a polymer binder are moderately blended according to the weight percentage, and in the preparation method, a ball mill, a constant-temperature drying box and a vibrating screen are used for obtaining 3D printing powder; and carrying out laser sintering, slicing the wave-absorbing pyramid to form a ceramic green body, and finally obtaining the silicon carbide ceramic wave-absorbing pyramid. The wide-frequency-band high-power high-flame-retardancy high-frequency-band high-absorption high-power high-flame-retardancy high-cleanliness microwave dielectric ceramic has the advantages of being wide in frequency band, high in absorption, high in high-temperature resistance, high in power, high in flame retardancy and high in cleanliness, restrictions of mold forming are The product is suitable for personalized, diversified and customized batch production, a complex hollow structure product can be produced, the development efficiency is high, and great economic value is achieved.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner CHANGPING BEIJING ELECTROMAGNETIC PROTECTION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap