Soldering apparatus

[0063] Description will be hereinafter made of a soldering apparatus according to a first embodiment of the present invention with reference to FIGS. 1 to 3.

[0064]FIG. 1 depicts a solder vessel 101 shown in a vertical cross-sectional view and a control system shown in a block diagram. The solder vessel 101 has vessel walls including a bottom wall 101a along which a heater 109 for melting a solder 100 in the solder vessel 101 and maintaining the molten solder 100 at a desired temperature is disposed.

[0065] Designated as 201 is a temperature control device for controlling the temperature of the solder 100 in the solder vessel 101. The temperature control device 201 controls the temperature of the solder 100 at a desired value by controlling the supply of electric power to the heater 109 based on the result of detection by the temperature sensor 106.

[0066] The bottom wall 101a of the solder vessel 101 is provided with a hole 108, to which a linear pipe 302 for an ALIP type electromagne

[0094] Description will be hereinafter made of a soldering apparatus according to a second embodiment of the present invention with reference to FIG. 5.

[0095]FIG. 5 is a view illustrating an example of the configuration of a soldering apparatus according to the second embodiment of the present invention, in which a solder vessel 101 is shown in a vertical cross-sectional view, and a control system is shown in a block diagram. The component parts corresponding to those in FIG. 1 are designated by the same reference numerals, and their description will not be repeated here. The difference between this embodiment and the first embodiment shown in FIG. 1 is that the bottom wall 101a of the solder vessel 101 has a recess 111 for receiving the drive means 301 (the outer core 301a and the coils 301b ) to increase the capacity of the solder vessel 101 without increasing the maximum dimensions of the soldering apparatus.

[0096] In this configuration, since heat loss from the electromagnetic pu

[0099] The soldering apparatus disclosed in JP-A-2005-205479 has a heater for heating the solder in the solder vessel, a temperature sensor, and a temperature controlling device to melt the solder in the solder vessel and maintain the molten solder at a desired temperature. However, since the ALIP type electromagnetic pump is located outside the walls of the solder vessel and since solders have a high heat of fusion, it takes a long time until the solder in the linear pipe of the electromagnetic pump is melted completely after the solder in the solder vessel has been melted.

[0100] Therefore, it takes a long time until a projected wave can be formed after the start of the soldering apparatus.

[0101] The soldering apparatus disclosed in JP-A-2005-205479 is provided with a cap for closing the injection port of the nozzle so that induction heating of the solder in the linear pipe can be performed with the injection port of the nozzle closed with the cap. The induction heating is performed