2 results about "Contact friction" patented technology

The invention relates to a rough surface treatment device for an inner groove of a quartz substrate for an optical fiber coupler, which includes a fixed workbench, a flexible brush, a mortar nozzle and a reciprocating drive device. The flexible brush is correspondingly installed above the fixed workbench, and the flexible brush It includes a brush plate and bristles fixed under the brush plate, the brush plate is provided with a through hole, the mortar nozzle is installed above the flexible brush, the mortar can flow out from the mortar nozzle, and pass through the The bristles flow into the through holes, and the reciprocating drive device is connected with the flexible brush plate to drive the flexible brush to reciprocate. The invention uses a flexible brush to drive the mortar to perform soft contact friction on the inner groove of the quartz substrate, which not only has little damage to the workpiece, but can greatly reduce the processing stress of the product, and the rough surface is evenly sanded, and the processing quality of the workpiece is good; the processing device and process are simple and no high-tech is required. Accurate alignment, increasing the area of ​​the flexible brush can be processed in batches at the same time, and the processing efficiency is high; no chemical corrosive agent is used in the present invention, which is beneficial to environmental protection.

The invention provides a cutting machine for cutting silicon chips, which comprises a support plate and a glass plate, wherein knurling patterns are arranged on the side of the support plate in contact with the silicon chips. Because the knurling patterns are arranged on the side of the support plate in contact with the silicon chips, the contact friction force of the support plate and the silicon chips is improved, the connection between the silicon chips and the support plate is firmer, the damage to the silicon chips caused by falling is avoided, and the finished product rate of the silicon chips is improved. In addition, the cutting machine has a simple structure.