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5 results about "Element analysis" patented technology

Actual load measuring method of ultra-high-rise steel and concrete combination structure

InactiveCN103577693ASpecial data processing applicationsNumeric ValueElement analysis
The invention discloses an actual load measuring method of the ultra-high-rise steel and concrete combination structure. The actual load measuring method includes the following steps that a reasonable measurement manner is adopted for carrying out load bearing entity measurement on the full process of concrete frame core cylinder structure construction; by combining with an actual measurement result, a finite element analysis SAP 2000 is used for setting up a reasonable concrete frame core cylinder structure construction stage vertically stressed and deformation analysis model which is used for numerical analysis and calculation; entity measurement and analog computation are analyzed. According to the actual load measuring method of the ultra-high-rise steel and concrete combination structure, the method combining on-spot entity measurement and numerical analysis computing is adopted, the reasonable measurement manner is used for carrying out load bearing entity measurement on the full process of the concrete frame core cylinder structure construction, the finite element analysis SAP 2000 is used for setting up a reasonable concrete frame core cylinder structure construction stage vertical stressed and deformation analysis model which is used for numerical analysis and calculation; the actual measurement results are combined for carrying out comparison and analysis. In addition, the actual load measuring method is convenient to carry out, the measurement results are accurate and good application value is achieved.
Owner:CHONGQING UNIV

Solver for a restrained deformable system with released degrees of freedom

ActiveUS20070007382A1Minimizing energyActuated automaticallyGenitals massageElement analysisEngineering
A process of using finite element analysis for determining the behaviour of a system, submitted to predetermined load and displacement boundary conditions with a degree of freedom relative to a local coordinate system released at one node of the system. For a geometrically non-linear solution scheme, a plurality of incremental steps are carried, for which computing for a finite element of the system a displacement vector at the nodes of the finite element is performed by minimizing the energy of the system. For a geometrically linear solution scheme, a single solving step is carried, for which similar steps of computing for a finite element and timely minimizing of the system's energy are performed. The step of minimizing is carried out, for a node having a released degree of freedom, in a local frame of reference, and the released degree of freedom at the node is expressed along one axis of such frame. Such hybrid reference frames allow expressing and taking into account in the global formulation the constraints of the non-released degrees of freedoms in a simple manner, without having to factorise constraints.
Owner:DASSAULT SYSTEMES

Metal additive forming part surface heat transfer coefficient simulation method based on heat flow coupling

ActiveCN112699592AAccurate boundary conditionsAccurate Numerical Simulation ResultsGeometric CADDesign optimisation/simulationHeat flowElement analysis
The invention discloses a metal additive forming part surface heat transfer coefficient simulation method based on heat flow coupling. The method comprises the following steps: (1) compiling a geometric model of a printed part and a flow field around the printed part by utilizing three-dimensional drawing software, and carrying out finite element analysis; (2) endowing the geometric model with corresponding material attributes; (3) performing tetrahedral mesh division on the geometric model; (4) establishing a temperature field heat transfer analysis module for solving the metal additive printing process; (5) establishing a volume heat source module for simulating a laser heating process in metal additive printing; (6) establishing a fluid analysis module for solving a flow field model in the metal additive printing process; and (7) setting solving time and solving the temperature field and the flow field at the same time to obtain a surface heat transfer coefficient. The printed piece surface heat transfer coefficient obtained by the method provides accurate boundary conditions for numerical simulation (such as heat flow simulation and thermal simulation) of additive manufacturing, so that the numerical simulation result is accurate.
Owner:SICHUAN UNIV

Design method of near-junction cooling structure of ultrahigh heat flow radio frequency microsystem

ActiveCN111832206AImprove reliabilityImprove design efficiencyDesign optimisation/simulationConstraint-based CADElement modelElement analysis
The invention discloses a design method of a near-junction cooling structure of an ultrahigh heat flow radio frequency microsystem. Firstly, carrying out discretization of a design area; setting boundary conditions according to actual working conditions; introducing reverse permeability and thermal conductivity related to the pseudo-density value to initialize a finite element model of a design area; carrying out finite element analysis according to a Stokes flow model and a convective diffusion equation; obtaining information of a flow field and a temperature field in an iterative computationmode; calculating a target function by utilizing the obtained physical field information; iterating under MMA algorithm updating according to the constraint function, the target function and the sensitivity of the constraint function to the design variable until the maximum fluid volume ratio allowed in the design process and the maximum outlet and inlet pressure difference allowed in the designprocess are met at the same time, or the number of iterations reaches the set maximum number of iterations. According to the method, the design reliability is improved, the design efficiency is higher, the design result is better, and meanwhile the design cost is reduced.
Owner:XI AN JIAOTONG UNIV
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