Light-emitting diode packaging structure

A light-emitting diode and packaging structure technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of light scattering, light loss, direct contact between light-emitting diode grains and fluorescent colloid layers, etc., to ensure the service life , reduce heat energy, increase the overall light output effect

Inactive Publication Date: 2010-09-15
FORWARD ELECTRONICS CO LTD
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This technology solves problems where there are no suitable spacers between an existing phosphors layer on top of each individual chip or lamps due to direct coating methods like spraying them onto the surface instead of applying them externally for better performance. By surrounding this special area around the yellow-green color filter (YAG) inside the lamp's package, less light escapes through these areas while still having good efficiency at converting blue into white colors. Additionally, the use of fluorescence gel also helps reduce thermal stress caused by water vapor exposures during manufacturing processes. Overall, this design improves both optical properties and reduces power consumption compared to traditional techniques used alone.

Problems solved by technology

Technological Problem addressed in this patents relates to improving the performance and lifespan of light sources like Light Emission Diodes (LED). Current solutions involve increasing brightness without reducing energy usage while maintaining durability over longer periods of operation. Additionally, existing techniques are expensive and require complicated processes with multiple components.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting diode packaging structure
  • Light-emitting diode packaging structure
  • Light-emitting diode packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] refer to figure 2 and image 3 , are respectively a perspective view and a cross-sectional view of a light emitting diode packaging structure in a preferred embodiment of the present invention. The LED packaging structure includes a light emitting diode crystal grain 10 , a transparent colloidal layer 11 , a fluorescent colloidal layer 12 , a conductive seat 13 , and a heat dissipation shell 15 . The LED crystal grain 10 used in this embodiment is a blue light crystal grain, and an ultraviolet light diode crystal grain can also be used, which is located on the die-bonding plane 17, and the LED crystal grain 10 is electrically connected to the conductive seat 13 through two wires 14 to conduct electricity. The seat 13 is composed of a positive pole bracket 131 and a negative pole bracket 132 representing two different polarities. It can be seen from the figure that the two brackets extend to the ends to form two external electrical pins 161 and 162 . The conductive base

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a light-emitting diode packaging structure which is formed in a main way that an inner transparent colloid layer is additionally arranged between a light-emitting diode crystalline grain such as a blue crystalline grain and a fluorescence colloid layer such as a yellow fluorescence colloid layer, and an outer transparent colloid layer is matched with the inner transparent colloid layer to wrap the fluorescence colloid layer so as to reduce the condition that light rays of the LED crystalline grain are absorbed by the LED crystalline grain because of the reflection of fluorescent powder particles, which is helpful to improve the total light-emitting amount and lower the LED crystalline grain heat energy. In addition, the invention also provides better steam isolation for the fluorescent powder.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner FORWARD ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap