Semiconductor element, packaging structure and forming method of semiconductor element

[0014] The bumping process in semiconductor devices described below can be applied to flip-chip packaging, wafer-level chip-scale packaging (WLCSP), three-dimensional integrated circuit (3D-IC) stacking, and / or any advanced packaging technologies. Embodiments relate to solder bumps for semiconductor devices and methods of forming the same. In the following description, various specific examples will be preceded to facilitate those skilled in the art to have a comprehensive understanding of the present invention. However, those skilled in the art should understand that the actual operation does not need to fully comply with these special cases. In some instances, structures and processes well known in the art have not been described in detail to avoid unnecessarily obscuring the disclosure. In the following description, "an embodiment" refers to a particular feature, structure, or structure in which at least one embodiment is combined. Thus, references to "an embodiment" in di