Semiconductor device structure and method for manufacturing same

[0051] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0052] It should be noted that the terminology used here is only for describing specific embodiments, and is not intended to limit the exemplary embodiments according to the present invention. As used herein, singular forms are intended to include plural forms unless the context clearly dictates otherwise. In addition, it should also be understood that when the terms "comprising" and / or "comprising" are used in this specification, it indicates the presence of the features, integers, steps, operations, means and / or components, but does not exclude the presence