HCT slicer precision adjusting method

The invention discloses an HCT slicer precision adjusting method, and relates to the technical field of slicing of solar silicon wafers. The HCT slicer precision adjusting method includes reversing the movement direction of a wire net when the proportion of rejects with uneven thicknesses and notches is higher than 2.5%. Particularly, the process of reversing the movement direction of the wire net includes adjusting the original wire inlet end as a wire outlet end and adjusting the original wire outlet end as a wire inlet end, so that affection to thicknesses of the wafers due to steel wire abrasion is consistent with a compensation value of the guide pulley groove pitch. The HCT slicer precision adjusting method has the advantages that since wire inlet and wire outlet directions of steel wires are adjusted by changing the original wire inlet end into the wire outlet end and changing the original wire outlet end into the wire inlet end, the steel wires with high sand carrying capacity and optimal sand carrying quantity are placed on a front bearing box (with slightly poor precision), and the abraded steel wires are placed on a back bearing box (with high precision), accumulative effects caused by various adverse factors are balanced, the slicing yield is increased, the proportion of reject silicon wafers with the uneven thicknesses and the notches can be reduced effectively, and the reject rate is decreased by 0.3-0.7% integrally.