Ultrasound thickness measuring method and device based on broadband frequency-modulation and receiving compensation

An ultrasonic and thickness measurement technology, which is applied in the direction of measuring devices, using ultrasonic/sonic/infrasonic waves, and using sound waves/ultrasonic/infrasonic waves to analyze solids, etc., can solve the problem of deviation of measured values ​​from normal values, false detection of echo pulse signals, and irregular material structures. Uniformity and other issues to achieve the effect of reducing volume and cost, widening signal bandwidth, reducing cost and volume

Inactive Publication Date: 2013-01-09
SOUTH CHINA UNIV OF TECH
View PDF6 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The technical effect described this patented technology improves upon previous methods for detecting flaws or defects caused by impact force waves generated during testing (acoustofluidics). By sending both high frequencies at once overlapping areas where there may have potential issues), these techniques help identify any weaknesses within those regions while also being able to accurately measure their size and shape under different environmental conditions such as temperature changes without affecting its performance significantly. This results in improved quality control measures and reduces costs associated with manufacturing processes.

Problems solved by technology

Technologies described in these technical problem addressed in this patents include limitations related to accurate measurements over complex structures like pipe walls, valves, etc., including sensitivity issues associated with conventional methods requiring long periods of operation, potential blind areas caused by background sounds, and difficulty in adjusting the instrument settings required for precise measurement.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrasound thickness measuring method and device based on broadband frequency-modulation and receiving compensation
  • Ultrasound thickness measuring method and device based on broadband frequency-modulation and receiving compensation
  • Ultrasound thickness measuring method and device based on broadband frequency-modulation and receiving compensation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The implementation of the present invention will be further described below in conjunction with the accompanying drawings, but the implementation and protection scope of the present invention are not limited thereto.

[0034] Such as figure 1 Shown is a system block diagram of the ultrasonic thickness measuring device based on broadband frequency modulation and receiving compensation according to the present invention. The device includes two parts: a handheld control and display and an array ultrasonic probe assembly. The handheld control and display consists of a power supply, a display, an input control unit, a microcontroller, A / D and D / A converters, and an external interface. , external interfaces include network interface, printer interface, fault diagnosis interface and ultrasonic probe interface, etc.

[0035] The microprocessor is connected with A / D and D / A converter, input control unit, display, network interface, printer interface, fault diagnosis inter

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an ultrasound thickness measuring method and a device based on broadband frequency-modulation and receiving compensation. Thee method structures an intermittent type broadband linear frequency-modulation ultrasound signal by using the method of linear frequency-modulation; broadcasting time of the intermittent type broadband linear frequency-modulation ultrasound signal at the inner part of a workpiece is inverted according to frequency parameters of emitted and received frequency-modulation signals; workpiece thickness is obtained by combining a preset sound speed. The device comprises a handhold type control, a display and an array type ultrasound wave probe component, wherein the array type ultrasound wave probe component is composed of a plurality of ultrasound transducers capable of stimulating the broadband linear frequency-modulation ultrasound wave, wherein one ultrasound transducer is arranged in the middle, and the rest ultrasound transducers are arranged at four sides. The ultrasound thickness measuring method and the device can realize the flaw detection at a near field and a remote field; and the invention is low in energy loss, small in volume, high in precision and strong in antijamming capability; and furthermore, the ultrasound thickness measuring method and the device can adapt various noise environments.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner SOUTH CHINA UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap