Amplitude impedance calibrated three-dimensional package surface antenna

A three-dimensional packaging and impedance calibration technology, applied to waveguide horns, circuits, etc., can solve the problems of incompatibility, inability to improve the inconsistency between the horn antenna and free space wave impedance, and increase the overall structural size of the antenna to achieve the effect of improving consistency.

Inactive Publication Date: 2013-04-03
SOUTHEAST UNIV
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  • Description
  • Claims
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Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure
In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration. However, the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. One of the reasons is that the antenna The wave impedance of electromagnetic waves on the aperture surface is different from that of free space, which will cause electromagnetic wave reflection on the interface between the medium and the air, affecting the return loss and radiation perform

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[0021] The present invention will be further described below in conjunction with drawings and embodiments.

[0022]The implementation scheme adopted in the present invention is: the three-dimensional package surface antenna with amplitude impedance calibration is composed of three parts: metallized vertical via hole feeder 1, substrate integrated waveguide horn antenna 2 and embedded metallized via hole 3, these three parts are integrated On the same dielectric substrate 4 , the dielectric substrate 4 is on the top of the three-dimensional package 5 ; the metallized vertical via hole feeder 1 vertically penetrates the dielectric substrate 4 , and one end of the metallized vertical via hole feeder 1 passes through the metal plane 6 on the bottom surface of the dielectric substrate 4 The round hole 7 on the top is connected to the internal circuit 8 of the three-dimensional package 5, which is the input and output port of the antenna. There is a circular pad 10 on the top of the oth

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Abstract

The invention relates to a horn antenna, in particular to an amplitude impedance calibrated three-dimensional package surface antenna which comprises a metalized vertical via feeder (1), a horn antenna (2) and metalized via holes (3), wherein the metalized vertical via feeder (1), the horn antenna (2) and the metalized via holes (3) are integrated on a dielectric substrate (4) which is arranged on the topside of a three-dimensional package (5). One end of the metalized vertical via feeder (1) is connected with an internal circuit (8), the horn antenna (2) comprises a bottom metal plane (6), a top metal plane (9) and metalized via side walls (11), a via array consisting of the metalized via holes (3) comprises a middle metalized via array (17), a left metalized via array (18) and a right metalized via array (19), four dielectric filling waveguides are formed in the horn antenna (2), and port wave impedance of the four dielectric filling waveguides on an antenna caliber surface (12) is equal to free space wave impedance. Antenna caliber efficiency can be improved while return loss is reduced.

Description

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Claims

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Application Information

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Owner SOUTHEAST UNIV
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