Flexible circuit board laminated structure and mobile terminal

A flexible circuit and layer structure technology, applied in circuit devices, printed circuit components, reduction of crosstalk/noise/electromagnetic interference (etc.) problems, to achieve the effect of preventing interference from external radiation signals and static electricity, ensuring signal continuity, and reducing processing costs

Inactive Publication Date: 2016-03-16
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, if the above method is used, the cost will increase exponentially. At the same time, increasing the number of copper foil layers will increase the thickness of the FPC, which will greatly reduce the bending performance of the FPC. Reducing the number of FPC bending will affect the life of the product; Without a reference plane, the impedance requirement cannot be met and the product performance will be reduced
Although there are currently some methods of directly coating a layer of silver paste layer on the copper foil of the flexible circuit board to replace the method of increasing the number of layers of the above-mentioned copper foil; The process requirements are relatively high, and the coating uniformity of the silver paste layer must be ensured during coating. Uneven coating may easily lead to poor impedance continuity; in addition, because the silver paste layer is easily oxidized, it is also necessary to A layer of protective film is set on the top, while the process is more complicated, the processing cost also increases correspondingly, so it is not conducive to production and cost control

Method used

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  • Flexible circuit board laminated structure and mobile terminal

Examples

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[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0021] See figure 1 , A mobile terminal provided by an embodiment of the present invention includes a main body (not marked in the figure), a main board (not marked in the figure) provided inside the body, and a flexible circuit board laminated structure 100, the flexible circuit board being stacked The layer structure 100 is arranged inside the body and is electrically connected to the main board.

[0022] The mobile terminal may be a smart

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Abstract

The invention relates to a flexible circuit board laminated structure and a mobile terminal. The flexible circuit board laminated structure includes a substrate layer, a copper foil layer, a covering film and a shielding film; the copper foil layer is arranged on the substrate; the covering film is stacked on the copper foil layer; at least one through window is formed in the covering film; the at least one through window is communicated with the copper foil layer; the shielding film is stacked arranged on the covering film; and the shielding film is connected with the copper foil layer through the at least one through window. According to the flexible circuit board laminated structure provided by the invention, the shielding film is attached to the upper part of the covering film, and by means of the through windows in the covering film, the shielding film can be connected with the copper foil layer, so that the shielding film can be grounded, and therefore, a reference loop can be provided for wiring having impedance control requirements, and the impedance signals of a signal line can be more continuous; since the shielding film is attached directly to the upper part of the covering film, an attaching process is simple, and operation can be facilitated, and therefore, processing cost can be reduced; and a mode in which the upper part of a covering film is coated with silver slurry in the prior art can be replaced, and the problem of poor continuity of impedance signals cased by unevenness of the coating of the silver slurry can be solved.

Description

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Claims

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Application Information

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Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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