Reaction chamber and semiconductor processing device

A reaction chamber and chamber wall technology, which is applied in semiconductor/solid-state device manufacturing, metal material coating technology, ion implantation plating, etc., can solve problems such as poor contact, elastic fatigue, and poor deformation ability, and avoid The effect of sparking

Active Publication Date: 2017-05-03
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

[0007] Second, because the diameter of the induction coil 14 is only about 0.3mm, and the hardness of the snap ring 8 made of stainless steel is relatively high, and there are often dimensional tolerances in the design of mechanical components, these factors may cause the snap ring 8 and the induction coil to The poor contact between the electric coils 14

Method used

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  • Reaction chamber and semiconductor processing device
  • Reaction chamber and semiconductor processing device
  • Reaction chamber and semiconductor processing device

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Embodiment Construction

[0029] In order for those skilled in the art to better understand the technical solution of the present invention, the reaction chamber and semiconductor processing equipment provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0030] image 3 A cross-sectional view of a reaction chamber provided for an embodiment of the present invention. see image 3 , the reaction chamber 21 includes a base 23 , a snap ring 25 , a liner 26 , a detection device 29 and an adjustment device 27 . Wherein, the pedestal 23 is used for carrying the wafer 24, and the pedestal 23 is liftable, and when performing the process, the pedestal 23 rises to as high as image 3 Shown process position, now snap ring 25 utilizes self gravity to press the edge area of ​​wafer 24, thereby wafer 24 is fixed on the base 23; Meanwhile, base 23 is connected with radio frequency power supply 28, and this radio frequency power supply 28 is carrying out Du

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Abstract

The invention provides a reaction chamber and a semiconductor processing device. The semiconductor processing device comprises a base, snap rings, a detecting device and an adjusting device, wherein the base is used for bearing a wafer; a negative bias is applied to the base when the base is processed; the edge area of the upper surface of the wafer is pressed by the snap rings; the detecting device is used for detecting the negative bias of the base in a real-time manner, and sending the negative bias to the adjusting device; and the adjusting device is used for adjusting the voltage of the snap rings according to the negative bias of the base so as to enable the negative bias of the base to be consistent with the voltage of the snap rings. The reaction chamber, provided by the invention, can ensure that the negative bias of the base is consistent with the voltage of the snap rings so as to avoid a problem that sparking is generated between the snap rings and the base.

Description

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Claims

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Application Information

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Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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