LED device

[0058] like figure 1 As shown, this embodiment provides an LED device, including a bracket 1, the bracket 1 is provided with an inverted trapezoidal groove 4, the surface of the groove 4 is provided with a silver-plated layer, the bottom of the groove 4 is provided with a bipolar chip, and the groove 4 is provided with a bipolar chip. 4. The inside is filled with an encapsulating adhesive layer 3 covering the bipolar chip, and the encapsulating adhesive layer 3 is organic silica gel mixed with yellow fluorescent powder. The surface of the encapsulation adhesive layer 3 is provided with an isolation layer 5, the isolation layer 5 is a polymer, and its molecular formula is (Ph 3 SiO 1 / 2 ) a (CH 3 SiO 3 / 2 ) b ((CH 3 ) 2 SiO 2 / 2 ) c (SiO 2 ) d , where a:b:c:d=10:25:35:35. The isolation layer 5 is coated on the upper surface of the encapsulation adhesive layer 3 by spraying. The isolation layer 5 is used to prevent the encapsulation adhesive layer 3 and the light ref

[0060] like figure 2 As shown, the difference between this embodiment and Embodiment 1 is that: the surface of the packaging adhesive layer 3 is provided with an isolation layer 5, and the isolation layer 5 extends to the upper surface and the outside of the bracket 1, so that there is no gap between the packaging adhesive layer 3 and the bracket 1. The thickness of the packaging adhesive layer 3 is 400000nm, the thickness of the isolation layer 5 is 1000nm, and the thickness ratio of the isolation layer 5 to the packaging adhesive layer 3 is 0.25%.

[0062] The difference between this embodiment and embodiment 1 lies in that the thickness of the packaging adhesive layer 3 is 600000 nm, the thickness of the isolation layer 5 is 180000 nm, and the thickness ratio of the isolation layer 5 to the packaging adhesive layer 3 is 30%.