High-power semiconductor laser with lasing wavelength of 852 nm

A high-power, semiconductor technology, used in semiconductor lasers, lasers, laser parts and other directions, can solve the problems of inconvenient replacement absorption, no heat dissipation effect, inconvenient semiconductor laser fine-tuning, etc., to achieve the effect of easy replacement and increased stability

Active Publication Date: 2021-06-25
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology solves issues by moving an object within its own case or chamber while maintaining stable movement during use without slipping off easily due to instability caused by gravity. It uses a special mechanism called a stretchable linkage made of metal tubular members connected at their ends. When compressed, these links expand and help keep objects securely fixed against movements. Additionally, there are also covers attached to both cases to absorb excessive amounts of thermal energy generated during operations. Overall, this design improves safety measures and reduces wear and tear over time.

Problems solved by technology

The technical problem addressed by our research relates to improving the performance (efficiency) or lifetimes of semi conductors used in light sources like LEDs due to their unique properties. This requires precise adjustment during manufacturing processes without causing damage from excessive thermal energy generated through current coolants.

Method used

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  • High-power semiconductor laser with lasing wavelength of 852 nm
  • High-power semiconductor laser with lasing wavelength of 852 nm
  • High-power semiconductor laser with lasing wavelength of 852 nm

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0026] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0027] refer to Figure 1-6

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Abstract

The invention discloses a high-power semiconductor laser with the lasing wavelength of 852 nm, and belongs to the field of semiconductor lasers. The high-power semiconductor laser comprises a bottom plate, wherein an adjusting groove is formed in the position, which is close to the middle, of the upper end of the bottom plate, a limiting sliding groove is formed in the position, which is close to the middle, of the left inner side wall of the adjusting groove, a first shell is arranged in the adjusting groove, a limiting sliding block is arranged at the position, which is close to the bottom, of the left side of the first shell, a plurality of sets of tooth grooves are formed in the position, which is close to the bottom, of the right side wall of the first shell at equal intervals, and the first shell is movably arranged in the adjusting groove through cooperation of the limiting sliding block and the limiting sliding groove, a first groove is formed in the right side, which is close to the middle, of the bottom plate in a penetrating mode, a gear is movably arranged in the first groove, and the gear and the first shell are movably arranged through a tooth groove. According to the invention, a worker can finely adjust the position of the main body according to needs when using the laser, the heat dissipation effect of the semiconductor laser is improved, and the liquid bag absorbing enough heat can be replaced conveniently.

Description

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Claims

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Application Information

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Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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