An integrated circuit chip pin performance analysis method, device and equipment and a medium

A technology of integrated circuits and analysis methods, applied in the field of computer-aided engineering, can solve the problems of time-consuming and laborious, increase R&D cost and R&D cycle, and achieve the effect of saving time, improving R&D efficiency, and shortening R&D cycle.

Pending Publication Date: 2021-08-10
INSPUR BUSINESS MACHINE CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

This is time-consuming and labor-intensive, which significantly increases the R&D cost and R&D cycle of the enterprise

Method used

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  • An integrated circuit chip pin performance analysis method, device and equipment and a medium
  • An integrated circuit chip pin performance analysis method, device and equipment and a medium
  • An integrated circuit chip pin performance analysis method, device and equipment and a medium

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[0038] Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0039] The present invention provides a performance analysis method of an integrated circuit chip pin, such as figure 1 As shown, including the following steps:

[0040] S10, introducing the geometric data of the printed circuit board and integrated circuit chip into finite element modeling software, establish finite element model;

[0041] In practical applications, the printed circuit board is an electronically connected provider of electronic components, while the integrated circuit chip includes a silicon substrate, at lea

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Abstract

The invention discloses an integrated circuit chip pin performance analysis method, device and equipment and a medium, and the method comprises the steps of importing geometric data of a printed circuit board and an integrated circuit chip into finite element modeling software, and building a finite element model; carrying out finite element grid division on the main body parts of the printed circuit board and the integrated circuit chip to enable each pin of the chip to have a grid node; establishing a beam unit at each pin position and setting related contact relation failure parameters; completing modeling contents including endowing materials and attributes and setting connection relations and contact relations among parts in the finite element model, and setting constraint parameters and load parameters according to analysis working conditions; and performing operational analysis on the finite element model, and judging whether the pins of the integrated circuit chip meet related performance requirements of structural mechanics or not according to an operational analysis result. According to the invention, the links of producing test trial-manufactured parts and carrying out test can be omitted, the research and development efficiency is effectively improved, the research and development cost is reduced, and the research and development period is shortened.

Description

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Claims

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Application Information

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Owner INSPUR BUSINESS MACHINE CO LTD
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