Compact electronics plenum

a technology of compact electronics and plenums, applied in the direction of cooling/ventilation/heating modifications, semiconductor/solid-state device details, semiconductor devices, etc., can solve the problems of difficult to effectively cool some of these smaller device packages, and still generate a significant amount of hea

Inactive Publication Date: 2005-03-17
IGO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology uses a small space inside a container made of a special type of material that can absorb or release water vapor effectively. It allows for better control over temperature by allowing air to flow through it while still keeping any excess moisture away.

Problems solved by technology

This patent describes how small electronic devices can be reduced in size while also improving their efficiency. However, it becomes harder for them to dissipate this excessive heat without losing any performance or functionality. To solve this problem, there has been an improvement in technology that helps cool down certain parts of the device more efficiently.

Method used

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  • Compact electronics plenum
  • Compact electronics plenum
  • Compact electronics plenum

Examples

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Embodiment Construction

[0030] Referring now to FIG. 1, there is generally illustrated at 10 a power converter device thermally coupled to a plenum 12 according to a first preferred embodiment of the present invention. Plenum 12 is seen to have a plurality of passageways 14 each having an intake opening 15, and an opposing fan 16 at a exhaust opening 17 and thereof. Plenum 12 is also seen to include a plurality of receptacles 18 formed by integral downwardly extending members 20, each receptacle 18 seen to frictionally receive a respective heat generating electrical component 22. Plenum 12 is advantageously configured to wick heat from the heat generating members 22, and then transfer this heat to surface areas in contact with passageways 14 such that the flow of air therethrough removes heat therefrom. Device 10 is further seen to include a package housing 24 defining a chamber 26 therein housing other electrical component 28 forming a portion of the power converter housed therein.

[0031] Referring to FIG. 2

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PUM

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Abstract

A plenum (12, 60) having a plurality of heat fins (40, 72) and also a receptacle (20) for receiving a heat generating component (22) in a friction fit arrangement. The plenum has a plurality of passageways (14, 66) defined by the plurality of fins arranged in rows, and also includes a plurality of openings (50, 76) disposed between the fins, The receptacle frictionally receives a respective heat generating component (22), and wicks heat to the fins. Air communicating through the passageways defined by the fins removes heat from the fins, and also creates a venturi effect to remove heat from within a housing via the openings to further cool the portable electronic device.

Description

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Claims

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Application Information

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Owner IGO INC
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