Dissipative pick and place tools for light wire and LED displays

[0033] Various embodiments of the present invention allow for an LED to be picked up from a wafer and placed on a carrier with a pick-and-place tool or machine. The part of the tool that comes in contact with the LED is, in an embodiment, made with a conductive or insulative material that conducts electricity at a rate sufficient to prevent charge buildup but not at so high a rate as to overload the LED.

[0034]FIG. 1 illustrates a series of exemplary die collets, which may be used in various embodiments of the present invention with respect to conducting electricity at a rate sufficient to prevent charge buildup and also at a rate that prevents an overload of a device in contact or physical proximity of the die collets. Die collets may be used to attach, for example, a die to a substrate. The inside of die collets, in exemplary embodiments, may have slants sides (for example, 90 degrees) but may be modified to various slant configurations depending upon the needs of the particular tool