Heat dissipation device
a heat dissipation device and fan technology, applied in the direction of lighting and heating apparatus, semiconductor devices, tubular elements, etc., can solve the problems of fan generation vibration when operating, adversely affecting the operation stability of electronic components, and generating large amounts of heat during normal operation
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[0012]Referring to FIG. 1, a heat dissipation device in accordance with an embodiment of the disclosure dissipates heat generated by an electronic component (not shown), such as a CPU. The heat dissipation device comprises a substrate 10 attached to the electronic component, a fan 20 fixed on the substrate 10 by a clip 30, three heat pipes 40 and a fin assembly 50 located on the substrate 10.
[0013]Also referring to FIG. 2, the substrate 10 comprises a substantially square plate 12, two parallel and spaced panels 16 and a rectangular plate 14 positioned therebetween, all extending from the front end of the square plate 12.
[0014]The square plate 12 defines a rectangular hatch (not labeled) receiving a base 122 therein. The base 122 is near a right side and far from a left side of the square plate 12. The base 122 comprises a center core 124, with a bottom surface thereof attached to the electronic component. Three grooves 1240 are defined in a top surface of the center core 124 receiv...
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