System and Method For Adaptive Thermal Management In A Portable Computing Device

a portable computing and thermal management technology, applied in the direction of instruments, power supply for data processing, liquid/fluent solid measurement, etc., can solve the problems of temperature thresholds being exceeded, limit the extent to which the performance capabilities of the pcd can be exploited, etc., to reduce the performance level of one, the processing power of any given processing component is only reduced, and the performance level of the thermally aggressive component(s) is reduced.

Active Publication Date: 2014-01-02
QUALCOMM INC
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  • Abstract
  • Description
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AI Technical Summary

Benefits of technology

The present technology described in this patents allows monitoring certain parts of the device's environment during operation without causing damage due to over-temperature conditions. This helps prevent failures caused by high heat while still maintaining proper coolant flow rates. By measuring these measurements regularly, it can help manage the devices efficiently. However, there could also happen when there were problems where specific areas had exceed their normal limits because they werenormously affected by too many other things like humidity. These issues would cause further complications even though no problem was detected until later. To address them, systems have developed dynamically adjustable parameters called DVFS algorithms which gradually decrease the speed at which data samples take place compared to previous values. Whenever the measured value deviates above its predeteriorating limit, another algorithm will perform better control actions accordingly. Overall, these technical featments improve the efficiency and reliability of electronic equipment operations.

Problems solved by technology

The technical problem addressed in this patented text relates how to efficiently control the amount of power generated from these types of mobile device without compromising their functionality. Current solutions involve placing certain parts close together but doing nothing too much with them can lead to overheating and failures due to insufficient airflow around those areas where it needs to operate effectively.

Method used

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  • System and Method For Adaptive Thermal Management In A Portable Computing Device
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  • System and Method For Adaptive Thermal Management In A Portable Computing Device

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Embodiment Construction

[0020]The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any aspect described herein as “exemplary” is not necessarily to be construed as exclusive, preferred or advantageous over other aspects.

[0021]In this description, the term “application” may also include files having executable content, such as: object code, scripts, byte code, markup language files, and patches. In addition, an “application” referred to herein, may also include files that are not executable in nature, such as documents that may need to be opened or other data files that need to be accessed.

[0022]As used in this description, the terms “component,”“database,”“module,”“system,”“thermal energy generating component,”“processing component” and the like are intended to refer to a computer-related entity, either hardware, firmware, a combination of hardware and software, software, or software in execution. For example, a component may be, but is not limited to being, a proces

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Abstract

Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Description

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Claims

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Application Information

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Owner QUALCOMM INC
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