The invention relates to a
semiconductor device encapsulated in a
wafer level
chip size
package, including a
metal post surrounded in the resin and formed on the re-wiring layer connected with a pad
electrode; and an outer terminal connected with the surface of the
metal post, wherein, the shape of the
metal post is amended so that the first surface positioned near to the outer
electrode is larger than the second surface positioned near to the re-wiring layer.