Semiconductor element and wafer level chip size package having it

[0164] The present invention will now be further specifically described by way of examples with reference to the accompanying drawings.

[0165] 1. The first embodiment

[0166] will now refer to figure 1 , 2 , 3, 4A-4F and 5 to describe the semiconductor device according to the first embodiment of the present invention. Such as figure 1 and 2 As shown, the semiconductor device 1 includes: a semiconductor chip 3 having a rectangular plate-like shape in a plan view; an insulating layer 5 (used as a first insulating layer) formed on a surface 3a of the semiconductor chip 3; A plurality of connecting electrodes 7 and radiating electrodes 9 provided on it; a plurality of wiring portions 11, 13 and 15 formed on the surface 5a of the insulating layer 5 to establish mutual connection between the semiconductor chip 3 and the connecting electrodes 7 or radiating electrodes 9 and a molding resin 17 (used as a second insulating layer) that covers the surface 5a of the insulating l...