2 results about "Glycidyl ether" patented technology

The invention discloses a fiber-enhanced epoxy resin composition for quickly forming an automobile part and a preparation method thereof. The fiber-enhanced epoxy resin composition for quickly forming the automobile part comprises a component A and a component B. The component A comprises bisphenol A epoxy resin 127, a three-functional group glycidyl ether diluent XY636 and alicyclic epoxy resin TTA21; and the component B comprises diethylenetriamine DETA, isophorone diamine IPDA, methyl cyclohexanediamine HTDA, 1,3-bis(aminomethyl)-cyclohexan BAC and 2,4,6-tri(dimethylamino methyl) phenol DMP-30. The epoxy resin composition can be quickly cured and is suitable for a quick curing forming process of a fiber-enhanced composite material by means of a high pressure pouring process (HP-RTM) or a wet process molding process (WCM) and the like. The fiber-enhanced composite material prepared by the epoxy resin composition has excellent mechanical properties. The preparation method of the epoxy composition has the advantages of being simple in process and convenient to operate.

The invention relates to a high-bonding-strength conductive adhesive for repairable microelectronic assembly and a preparation method thereof. The high-bonding-strength conductive adhesive comprises the following raw materials in percentage by weight: resin, conductive filler, a curing agent, an active diluent and an additive, wherein the resin is prepared from the following raw materials in percentage by weight: bisphenol A epoxy resin and bisphenol F epoxy resin; the conductive filler is prepared from the following raw materials in percentage by weight: flake silver powder and spherical silver powder; the curing agent is prepared from the following raw materials in percentage by weight: 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, polyether amine 400 and triethanolamine; the reactive diluent is prepared from the following raw materials in percentage by weight: polyethylene glycol diglycidyl ether and polypropylene glycol diglycidyl ether; and the additive is a substance capable of achieving a thickening effect. The problems that an existing conductive adhesive is poor in conductivity, poor in bonding strength, incapable of being detached and repaired after bonding and the like are solved. The adhesive is widely applied to bonding materials for circuit connection of electronic components.