High-bonding-strength conductive adhesive for repairable microelectronic assembly and preparation method thereof

[0040] The resin is 20%-30%, the conductive filler is 60%-80%, the curing agent is 4%-8%, the active diluent is 1%-2%, and the additive is 1% %~5%.

[0041] The raw materials of the resin are composed by weight percentage: the bisphenol A epoxy resin is 40%-60%; the bisphenol F epoxy resin is 40%-60%.

[0042] The raw materials of the conductive filler are composed by weight percentage: the flaky silver powder is 60%-80%; the spherical silver powder is 20%-40%.

[0043] The raw material of the curing agent is composed of 10% to 20% of the 2-ethyl-4-methylimidazole; the 1-cyanoethyl-2-ethyl-4-methylimidazole 30% to 60%; the polyetheramine 400 is 5% to 10%; the triethanolamine is 30% to 60%.

[0044] The active diluent raw material is composed by weight percentage: the polyethylene glycol diglycidyl ether is 30%-50%; the polypropylene alcohol diglycidyl ether is 50%-70%.

[0045] The additive is polyamide wax.

[0047] The resin is 30%, the conductive filler is 60%, the curing agent is 8%, the reactive diluent is 1%, and the additive is 1%.

[0048] The raw materials of the resin are composed by weight percentage: 50% of bisphenol A epoxy resin and 50% of bisphenol F epoxy resin.

[0049] The raw materials of the conductive filler are composed by weight percentage: 50% of flake silver powder (particle size 10-20um) and 50% of spherical silver powder (particle size 3-8um).

[0050] The curing agent raw material is composed of 20% of 2-ethyl-4-methylimidazole, 50% of 1-cyanoethyl-2-ethyl-4-methylimidazole, 10% of polyetheramine 400, Triethanolamine 20%.

[0051] The active diluent raw material is composed of 60% of polyethylene glycol diglycidyl ether and 40% of polypropylene glycol diglycidyl ether by weight percentage.

[0052] The additive is polyamide wax added according to 100%.

[0053] Accurately weigh according to the ratio of the above raw materials, mix 2-ethyl-4-methylimidazo

[0057] The resin is 20%, the conductive filler is 70%, the curing agent is 6%, the reactive diluent is 2%, and the additive is 2%.

[0058] The raw materials of the resin are composed by weight percentage: 50% of bisphenol A epoxy resin and 50% of bisphenol F epoxy resin.

[0059] The raw materials of the conductive filler are composed by weight percentage: 50% of flake silver powder (particle size 10-20um) and 50% of spherical silver powder (particle size 3-8um).

[0060] The curing agent raw material is composed of 20% of 2-ethyl-4-methylimidazole, 50% of 1-cyanoethyl-2-ethyl-4-methylimidazole, 10% of polyetheramine 400, Triethanolamine 20%.

[0061] The active diluent raw material is composed of 60% of polyethylene glycol diglycidyl ether and 40% of polypropylene glycol diglycidyl ether by weight percentage.

[0062] The additive is polyamide wax added according to 100%.

[0063] Accurately weigh according to the ratio of the above raw materials, mix 2-ethyl-4-methylimidazole