Apparatus and method for treating substrate

The technology of a substrate processing device and a substrate processing method, which is applied in the field of substrate processing devices, can solve the problems of increasing the area of ​​equipment and increasing the process time of transferring substrates, and achieve the effect of reducing the area of ​​equipment and shortening the process time

Active Publication Date: 2013-01-30
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The technical effect described by this patented technology allows for faster processing without having multiple steps involved or requiring different types of materials being transferred from one machine to another. This reduces manufacturing times while also reducing space requirements on production lines.

Problems solved by technology

This technical problem addressed in this patented text relates to improving efficiency when producing large displays while reducing costs associated with maintaining high quality coatings during production processes. Prior methods require multiple steps involving separate machines or have issues related to increased space requirements due to their involvement across various stages involved.

Method used

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  • Apparatus and method for treating substrate
  • Apparatus and method for treating substrate
  • Apparatus and method for treating substrate

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Embodiment Construction

[0055] Hereinafter, a substrate processing apparatus and method according to preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, when it is judged that the detailed description of related known structures or functions may obscure the gist of the present invention, the detailed description will be omitted.

[0056] figure 1 is a perspective view showing a substrate processing apparatus according to an embodiment of the present invention, figure 2 is showing figure 1 A top view of the substrate processing apparatus.

[0057] refer to figure 1 and figure 2 , the substrate processing apparatus 10 applies the processing liquid onto the substrate S. The substrate processing apparatus 10 includes a substrate support unit 100 , a stage unit 200 , a first processing liquid supply unit 300 , a second processing liquid supply unit 400 , a visual inspection unit 500 , and a nozzle

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Abstract

The invention provides an apparatus and a method for treating a substrate, and a whole process time can be shortened. According to one embodiment of the invention, the apparatus for treating the substrate comprises a substrate supporting unit for supporting the substrate; an ink nozzle for discharging a first treating liquid to the substrate; a coating nozzle for discharging a second treating liquid different from the first treating liquid to the substrate; and a gantry unit for enabling the ink nozzle and the coating nozzle to linearly move along a first direction, so that positions of the ink nozzle and the coating nozzle change relative to the substrate supporting unit.

Description

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Claims

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Application Information

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Owner SEMES CO LTD
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