Multiple chip package (MCP) form of thermistor and wireless body temperature detection circuit

[0019] The features and advantages of the present application will be described with reference to the accompanying drawings.

[0020] figure 1 It is a schematic diagram of an embodiment of an MCP package form of a thermistor and a wireless body temperature detection circuit. The system consists of a thermistor probe 102, a wireless body temperature detection circuit chip 101, a substrate 104, an antenna 103, a fixed adhesive layer 105, a conductive The lead 106 and the package filling body 107 are composed.

[0021] The 101 is fixed on 104 through 105 .

[0022] The 103 is formed on the 104 by printing, and is distributed around the 105, and is connected to the 101 through the 106.

[0023] The 102 is fixed under the 104, and the 106 passes through the 104 and is connected with the 101.

[0024] The joints of 101, 102, 103, 104, 105, 106 are wrapped and fixed by 107. The connections between 101, 102 and 103 are welded.

[0025] figure 2 is based on figure 1 A schematic di