Thermally conductive insulating material for high-power LED substrate and preparation method thereof

A technology for thermally conductive insulating materials and LED substrates, applied in the field of material chemistry, can solve the problems of poor physical and thermal conductivity of thermally conductive resin materials, poor bending and kink resistance, and poor compression and shock resistance. The branch copolymerization reaction is sufficient, the rate is fast, and the effect of increasing stiffness

Active Publication Date: 2015-08-12
CHANGZHOU TONGBAO PHOTOELECTRIC MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology allows for better heat conduction while maintaining its strength when compared to existing materials that are made from plastic or metal alone due to improved thermal insulation provided during manufacturing process. Additionally, this new method improves the quality control over the final product's performance because there is no direct contact between the added particles and other components within the polymers themselves.

Problems solved by technology

This patented technical problem addressed in this patents relating to improving the efficiency of power semiconductor packages (LED) due to their limited use compared to other types such as bulbs and tungsten lamps. Current methods involve replacing expensive metal plugs on circuit board assemblies with polymethylene resins, which results in decreased lifespan and increased costs associated therewith. To address these issues, researchers explored various new ways to enhance cooling capabilities without increasing manufacturing complexity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] This embodiment provides a thermally conductive insulating material for a high-power LED substrate, and the thermally conductive insulating material for a high-power LED substrate is prepared through the following steps:

[0033] (1) In parts by mass, add 30 parts of silicon oxide powder with an average particle size of 10nm to 3 parts of graft modifier maleic anhydride, then add 0.1 part of dispersant to polyacrylamide, and stir for 10 to 15 minutes. Then use ultrasonic dispersion for 20 to 30 minutes to disperse the nano-silica powder in the mixed solvent of maleic anhydride and polyacrylamide to form an emulsion-like dispersion;

[0034] (2) adding the emulsion-like dispersion prepared in the above step (1) to ultrasonic spray drying equipment for spray drying to prepare a powdery composite material containing nano-silicon oxide;

[0035] (3) Add the powdered composite material prepared in the above step (2) together with 7 parts of polypropylene resin powder from the f

Embodiment 2

[0042] This embodiment also provides a thermally conductive insulating material for a high-power LED substrate. The thermally conductive insulating material for a high-power LED substrate is prepared through the following steps:

[0043] (1) In parts by mass, add 80 parts of alumina powder with an average particle size of 30nm to 20 parts of graft modifier oleic acid, then add 10 parts of dispersant sodium lauryl sulfate, and stir for 10 to 15 minutes, and then use ultrasonic dispersion for 20 to 30 minutes to disperse the nano-alumina powder in the mixed solvent of oleic acid and sodium lauryl sulfate to form an emulsion-like dispersion;

[0044] (2) adding the emulsion-like dispersion prepared in the above step (1) to ultrasonic spray drying equipment for spray drying to prepare a powdery composite material containing nano-silicon oxide;

[0045] (3) Add the powdered composite material prepared in the above step (2) together with 40 parts of polyethylene resin powder from the f

Embodiment 3

[0052] This embodiment also provides a thermally conductive insulating material for a high-power LED substrate. The thermally conductive insulating material for a high-power LED substrate is prepared through the following steps:

[0053] (1) In parts by mass, add 30 parts of magnesium oxide powder with an average particle size of 50nm to 20 parts of graft modifier acrylic acid, then add 10 parts of dispersant as fatty acid polyethylene glycol ester, and stir for 10 to 15 minutes , and then use ultrasonic dispersion for 20 to 30 minutes to disperse the nano magnesium oxide powder in a mixed solvent of acrylic acid and fatty acid polyethylene glycol ester to form an emulsion-like dispersion;

[0054] (2) adding the emulsion-like dispersion prepared in the above step (1) to ultrasonic spray drying equipment for spray drying to prepare a powdery composite material containing nano-magnesia;

[0055] (3) Add the powdered composite material prepared in the above step (2) together with 40

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Abstract

The present invention provides a thermally conductive insulating material of a high power LED substrate, which material is prepared using the following steps: in parts by weight, adding 30-80 parts of a nano-scale inorganic thermally conductive powder into 3-20 parts of a grafting modifier, then adding 0.1-10 parts of a dispersant, stirring and dispersing so as to disperse the nano-scale inorganic thermally conductive powder in the mixed agent of the grafting modifier and the dispersant; adding the product of the above step into an ultrasonic spray-drying apparatus to carry out drying so as to prepare a composite material; adding the product from the above step and 7-40 parts of a polyolefin resin together into a twin-screw extruder, and at the same time adding 0.1-2 parts of an initiator to initiate the graft copolymerization carried out in the twin-screw extruder, so as to extrude the pellets and prepare the thermally conductive insulating material. By first grafting the inorganic nano thermally conductive powder into the polyolefin resin by means of the graft modifier, the problem of the agglomeration of inorganic nano thermally conductive powder caused by directly adding inorganic nano thermally conductive powder into the resin material is avoided.

Description

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Claims

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Application Information

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Owner CHANGZHOU TONGBAO PHOTOELECTRIC MFG CO LTD
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