Super-fine grain twin-peak copper preparing method

A technology of ultra-fine grain and copper powder, applied in the direction of nanotechnology, can solve the problems of affecting material properties, low general toughness and ductility, unfavorable basic research work, etc., and achieve superior mechanical properties, high density, and simple process Effect

Inactive Publication Date: 2015-07-01
NORTH CHINA ELECTRIC POWER UNIV (BAODING)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

2) Amorphous crystallization method, it is difficult to obtain large-sized bulk ultra-fine-grained materials by this method
3) Electrodeposition method, the ultrafine-grained material prepared by this method may have some holes or some brittle elements such as H and S at the grain boundary or the intersection of three crystals, which will affect the performance of the material
Moreover, at present, it can only obtain bulk nanocrystalline materials with a thinner thickness, and it is still very difficult to prepare bulk ultrafine-crystalline materials with a larger thickness.
4) Large plastic deformation method, the bulk material prepared by this method has experienced large plastic deformation, and generally has low toughness and ductility, which prevents its wide engineering application
5) Mechanical alloying (MA) combined with pressurized block method, this method is prone to impurities, pollution and oxidation during the grinding process, so it is difficult to obtain a clean ultrafine crystal interface, so some basic research work unfavorable

Method used

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  • Super-fine grain twin-peak copper preparing method
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  • Super-fine grain twin-peak copper preparing method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0016] Example 1:

[0017] A preparation method of ultra-fine crystal bimodal copper material includes the following steps:

[0018] Mixing: Use a TLHL three-dimensional blender to uniformly mix 70% by mass nanometer copper powder and 30% by mass micron copper powder for 20 minutes to obtain mixed copper powder;

[0019] Reduction: performing hydrogen reduction on the mixed copper powder in a high vacuum furnace for 30 minutes to 60 minutes to obtain reduced mixed copper powder, and the reaction temperature is set to 400°C to 500°C;

[0020] Cooling: cooling the reduced mixed copper powder to room temperature in an argon atmosphere;

[0021] High-temperature pressurization: the cooled reduced mixed copper powder is compressed at high temperature at 700°C, 800°C, and 900°C respectively; the pressure conditions of each compression process are all 5GPa; each compression process includes boosting 15 minutes, pressure maintaining for 30 minutes, and pressure reduction for 20 minutes; the press

Example Embodiment

[0030] Example 2:

[0031] A preparation method of ultra-fine crystal bimodal copper material includes the following steps:

[0032] Mixing: Use a TLHL three-dimensional mixer to uniformly mix 90% by mass nanometer copper powder and 10% by mass micron copper powder for 20 minutes to obtain mixed copper powder;

[0033] Reduction: performing hydrogen reduction on the mixed copper powder in a high vacuum furnace for 30 minutes to 60 minutes to obtain reduced mixed copper powder, and the reaction temperature is set to 400°C to 500°C;

[0034] Cooling: cooling the reduced mixed copper powder to room temperature in an argon atmosphere;

[0035] High-temperature reduction: the cooled reduced mixed copper powder is compressed at high temperatures at 700°C, 800°C, and 900°C; the pressure conditions of each compression process are all 5 GPa; each compression process includes a pressure increase 15 Minutes, pressure retention for 30 minutes, and pressure reduction for 20 minutes; the pressure reten

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Abstract

The invention discloses a super-fine grain twin-peak copper preparing method, comprising the steps of mixing, reduction, cooling and high-temperature pressurization. The super-fine grain twin-peak copper preparing method is low in cost, high in yield, simple in process, applicable to large-scale production and capable of controlling the dimension distribution of material grains well. The prepared super-fine grain twin-peak copper has no alloying; coarse-grain copper is uniformly distributed in a copper base; and the prepared super-fine grain twin-peak copper has little caking and pores and is high in density and excellent in mechanical property.

Description

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Claims

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Application Information

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Owner NORTH CHINA ELECTRIC POWER UNIV (BAODING)
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