Stacked module heat radiation structure and manufacturing method thereof

A heat dissipation structure and module technology, which is applied in the production of stacked module heat dissipation structure and the field of stacked module heat dissipation structure, can solve the problems of high chip temperature in the package, exceeding thermal specifications, complex structure, etc., and achieve easy operation and thermal resistance. Reduced, easy-to-step effects

Inactive Publication Date: 2015-09-09
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, PoP packaging usually adopts a two-layer package stacking structure. This vertical stacking makes the PoP package structure more complicated, and the air fluidity between the upper and lower packages becomes poor. The heat dissipation of the PoP package is mainly through the upper package. and the bottom substrate as the main path, resul

Method used

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Example Embodiment

[0037] The present invention will be further described below in conjunction with specific embodiments.

[0038] The heat dissipation structure of the stacked module includes a lower packaging substrate 1, a second solder ball 2, a second potting compound 3, a third chip 4, an upper packaging substrate 5, a first solder ball 6, a plastic package 7, and a first potting The encapsulant 8, the first chip 9, the heat sink 10, the second chip 11 and the lead 12, the heat sink 10 has an integrated base, and a downwardly convex protrusion is provided on the lower surface of the base; A second solder ball 2 is soldered on the lower surface of the package substrate 1, a third chip 4 is fixed on the middle of the upper surface of the lower package substrate 1 by a second potting glue 3, and an upper package substrate is provided above the lower package substrate 1. 5. A window is opened in the middle of the upper packaging substrate 5, and a first solder ball 6 is soldered on the lower surface

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Abstract

The invention discloses a stacked module heat radiation structure and a manufacturing method thereof. Second tin balls are welded on the lower surface of a lower packaging substrate. A third chip is fixed at the middle position of the upper surface of the lower packaging substrate. An upper packaging substrate is arranged above the lower packaging substrate. The middle position of the upper packaging substrate is provided with a window. First tin balls are welded on the lower surface of the upper packaging substrate. The first tin balls contact with the upper surface of the lower packaging substrate. The upper surface of the upper packaging substrate is provided with a plastic sealing member. A first chip is fixed on the upper surface of the upper packaging substrate at an inner position which corresponds with the plastic sealing member through first sealing glue. The projection of the base of a heat radiating plate penetrates through the window of the upper packaging substrate and is fixed with the upper surface of the third chip. According to the stacked module heat radiation structure, thermal resistance is reduced through the heat radiating plate structure, and a problem of overhigh temperature of the PoP can be effectively prevented.

Description

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Claims

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Application Information

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Owner NAT CENT FOR ADVANCED PACKAGING
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