Two-dimensional transmission-type chip burning equipment

A burning equipment and conveying technology, which is applied in the direction of conveyor objects, transportation and packaging, electrical components, etc., can solve the problem of complex layout setting of processing modules and handling mechanism, reduction of chip handling efficiency and processing efficiency, and influence on chip position accuracy, etc. problem, to achieve the effect of simple and effective moving path, improving processing efficiency and handling efficiency, and improving processing accuracy

Pending Publication Date: 2018-11-20
GUANGZHOU MINGSEN TECH CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology allows chips from different manufacturers or sources to communicate easily during their production processes without being affected negatively due to differences in physical properties such as size and shape. It also simplifies the way these components interact within an integrated circuit device designing environment. By driving them horizontally along one axis, it achieves precise alignment and position control over the wafer movements. Overall, this innovation enhances overall chip processing capabilities and reduces damage caused by thermal shock on sensitive circuits used inside the chip itself.

Problems solved by technology

This technical problem addressed by this patented describes how complex the process of compiling computer programs onto small integrated circuits (ICs) can lead to reduced productivity due to longer wafer-to-wafer transfers that take place during production. Additionally, there may occur errors when trying to locate or move certain parts within these IC packages with high precision requirements such as memory devices.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Two-dimensional transmission-type chip burning equipment
  • Two-dimensional transmission-type chip burning equipment
  • Two-dimensional transmission-type chip burning equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The present invention will be further described below in conjunction with the examples and drawings, but the embodiments of the present invention are not limited thereto.

[0050] see Figure 1-Figure 6 , the chip programming device during two-dimensional transportation in this embodiment includes a chip supply module A, a processing module M, a handling module L, and a receiving and packaging module K; wherein, the processing module M includes horizontally arranged and equidistantly arranged Chip rotation positioning unit B, supplementary positioning unit C, burning unit D, laser marking unit E, burning information detection unit F, OCR detection unit G and handling temporary storage unit H on the frame; the handling module L It includes a moving plate 10 arranged above the processing unit, a horizontal driving mechanism that drives the moving plate 10 to move in the horizontal direction, and eight sets of vertical transport mechanisms P, and the eight sets of vertical tr

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses two-dimensional transmission-type chip burning equipment. The two-dimensional transmission-type chip burning equipment comprises a chip supply module, a processing module, a carrying module and a receiving package module, wherein the carrying module comprises a moving plate, a horizontal driving mechanism and a vertical carrying mechanism, the moving plate is arranged on the processing module, the horizontal driving mechanism is used for driving the moving plate to horizontally move, the vertical carrying plate comprises an absorption rod and a vertical driving mechanism, the vertical driving mechanism is used for driving the absorption rod to do vertical motion, the processing module comprises a burning unit, a laser coding unit, a burning information detection unit and an OCR detection unit which are sequentially arranged along a horizontal direction, the chip supply module is arranged at an upstream of the burning unit, and the receiving package module is arranged at a downstream of the OCR detection unit. Two-dimension moving of a chip is achieved during the whole processing process, so that the chip moving path is simple and effective, the chip processing efficiency and carrying efficiency are favorably improved, and meanwhile, the simple chip moving path is beneficial for improving the chip processing accuracy.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner GUANGZHOU MINGSEN TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap