MOS transistor switch, preparation method thereof and electronic device comprising the same

A technology of MOS transistors and switches is applied in the field of preparation of trench MOS devices, which can solve the problems of high cost and complicated preparation process, and achieve the effect of reducing cost and reducing photolithography process.

Inactive Publication Date: 2018-12-21
李卫刚
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the preparation process is complicated and the cost is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MOS transistor switch, preparation method thereof and electronic device comprising the same
  • MOS transistor switch, preparation method thereof and electronic device comprising the same
  • MOS transistor switch, preparation method thereof and electronic device comprising the same

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0045] The first embodiment of the present invention relates to a MOS transistor switch (such as figure 2 Shown), which is prepared on the substrate 200, the trenches in the epitaxial layer 201 are divided into two types, the first trench 2011 and the second trench 2012, the width of the second trench 2012 is larger than that of the first trench 2011, the first trench is filled with the first gate 202 and the second gate 204, the first gate 202 and the second gate 204 are separated by the gate interlayer dielectric layer 203, and the second trench 2012 The first gate 202 is filled, and the first gate metal 209 is drawn from the first gate in the second trench. By setting the trench with two different widths, the first gate metal is drawn from the first gate of the trench with a larger width, which makes the fabrication of the transistor easier.

[0046] The width and depth of the first trench and the second trench can be designed according to requirements. In a specific embodiment,

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Widthaaaaaaaaaa
Widthaaaaaaaaaa
Login to view more

Abstract

A MOS transistor switch Fabricated on substrate, The epitaxial layer of the substrate is provided with a first trench and a second trench, the width of the second trench is larger than the first trench, the first trench is filled with a first gate and a second gate, the first gate and the second gate are separated by a gate interlayer dielectric layer, the second trench is filled with a first gate, and the first gate metal is led out from the first gate in the second trench. The fabrication process of the device can be simplified by providing trenches with different widths so that the first gate of the second trench with a large width of the first gate metal is led out. The invention also discloses a preparation method of a MOS transistor switch and an electronic device comprising the MOStransistor switch.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner 李卫刚
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products