Method for welding magnesium target and copper back plate

A welding method and copper backplane technology, which is applied in the field of target material manufacturing, can solve problems such as insufficient metallurgical bonding between brazing filler metal and backplane, magnesium target oxidation, etc., and achieve the effects of eliminating oxidation, improving welding bonding strength, and enhancing welding strength

Inactive Publication Date: 2021-02-12
河南东微电子材料有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology involves creating a new type of material called Magnesia (MgO) that prevents corrosion on certain materials during manufacturing processes such as casting or machining metals. It also helps improve their joining with other parts like steel plating by reducing air bubbles formed at high temperatures when molten iron comes into contact therewith. Additionally, it uses Indium-Copper alloys instead of Silver as its main component due to better heat conduction properties compared to silver alone. These technical improvements make MgO more effective than traditional methods while maintaining good quality standards.

Problems solved by technology

This patented technical solution describes various ways to improve the performance or durability of metal plates (M) during electronic device fabrications like MOSFETS/LSI circuits. These improvements aim at reducing particle impact damage while maintaining strong adhesion with other components that may come into contact under certain conditions. Additionally, these techniques help prevent corrosion caused by impurities in the Mg target itself.

Method used

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  • Method for welding magnesium target and copper back plate
  • Method for welding magnesium target and copper back plate

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0030] Example 1: Welding a magnesium target with a diameter of 160mm:

[0031] After the magnesium target and the copper back plate were polished with a steel brush, they were cleaned in acetone to remove oil stains, and then in 50g / L NaOH, 10g / LNa 3 PO 4 After washing with alkaline solution for 15s, wash with deionized water and dry in vacuum.

[0032] Place the magnesium target material, the back plate, and the solder block on the heating platform 1, wherein the solder block is respectively placed on the welding surface of the magnesium target material and the back plate, and the sealing cover 2 is put on the vacuum to 100Pa, and argon gas is introduced. Make the internal air pressure an atmospheric pressure; turn on the heating platform and set the temperature to 180°C, and keep the temperature constant until the solder is completely melted.

[0033] Operate the hand-held ultrasonic instrument through the hand hole, apply the brazing material repeatedly to completely in

example 2

[0039] Example 2: Welding a magnesium target with a diameter of 180mm:

[0040] After the magnesium target and the copper back plate were polished with a steel brush, they were cleaned in acetone to remove oil stains, and then in 50g / L NaOH, 10g / LNa 3 PO 4 After washing with alkaline solution for 20s, wash with deionized water and then vacuum dry.

[0041] Place the magnesium target material, the back plate, and the solder block on the heating platform 1, wherein the solder block is placed on the welding surface of the magnesium target material and the back plate respectively, cover the sealing cover 2 and evacuate to 200Pa, and pass in argon gas, Make the internal air pressure an atmospheric pressure; turn on the heating platform and set the temperature to 190°C, and keep the temperature constant until the solder is completely melted.

[0042] Operate the hand-held ultrasonic instrument through the hand hole, apply the brazing material repeatedly to completely infiltrate t

example 3

[0048] Example 3: Welding a magnesium target with a diameter of 200mm:

[0049] After the magnesium target and the copper back plate were polished with a steel brush, they were cleaned in acetone to remove oil stains, and then in 50g / L NaOH, 10g / LNa 3 PO 4After washing with alkaline solution for 20s, wash with deionized water and then vacuum dry.

[0050] Place the magnesium target material, the back plate, and the solder block on the heating platform 1, wherein the solder block is placed on the welding surface of the magnesium target material and the back plate respectively, cover the sealing cover 2 and evacuate to 300Pa, and pass in argon gas, Make the internal air pressure an atmospheric pressure; turn on the heating platform and set the temperature to 200°C, and keep the temperature constant until the solder is completely melted.

[0051] Operate the hand-held ultrasonic instrument through the hand hole, apply the brazing material repeatedly to completely infiltrate th

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Abstract

The invention provides a method for welding a magnesium target material and a copper back plate, and aims at solving the problems that in the prior art, the target is welded by hot isostatic pressing,electron beams, ion welding and other methods, the target is easy to deform, the grain size of the target is easy to abnormally grow, and the cost is not easy to control. In order to reduce the costand ensure the welding strength required by sputtering, innovation can be conducted on traditional welding. The starting point of the invention is to reduce cost and prevent the oxidation of a magnesium target. The method for welding the magnesium target material and the copper back plate comprises the steps of treating the welding faces of the magnesium target and the back plate; and placing themagnesium target, the back plate and a brazing filler metal block in an argon atmosphere platform, and conducting brazing, wherein the brazing temperature is slightly higher than the melting point ofthe brazing filler metal. The platform has the functions of vacuum pumping and on-line operation, so that the manufacturing cost is greatly reduced; and the components of the brazing filler metal areimproved, so that the welding bonding strength can be improved, and the welding strength implemented through the method provided by the invention can reach 50 Mpa or above.

Description

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Claims

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Application Information

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Owner 河南东微电子材料有限公司
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