Preparation method and application of wafer-level absolute single-layer transition metal chalcogenide

A technology of transition metal chalcogenides and transition metals, which is applied in the direction of metal material coating process, coating, gaseous chemical plating, etc., can solve the problem that it is difficult to directly obtain single-layer two-dimensional transition metal chalcogenide crystals, etc., to achieve Excellent photoelectric properties, high crystal quality, and large single crystal size

Active Publication Date: 2021-07-09
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented process involves combining both traditional methods for depositing thin films on silicon wafers with new techniques like atomic force microscopy or electron beam lithography. By treating the wafer after it's manufacturing processes, we get ridged metals from its surfaces which are highly pure but still very small compared to other materials used during production. These unique structures have great potential applications such as solar cells, sensors, displays, biomedical devices, etc..

Problems solved by technology

This patented technical problem addressed in this patents relates to finding ways to efficiently produce small amounts (<1 gmL) of specific types of atoms called molybdenum sulfide (MoSi2) that are important building blocks used in various industries like atomic physics and chemistry. Current methods involve growing these elements on different surfaces at once but they often result in multiple layers being formed during production which makes them challenging to prepare evenly.

Method used

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  • Preparation method and application of wafer-level absolute single-layer transition metal chalcogenide
  • Preparation method and application of wafer-level absolute single-layer transition metal chalcogenide
  • Preparation method and application of wafer-level absolute single-layer transition metal chalcogenide

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Embodiment 1

[0096] This embodiment provides an absolute single-layer WS 2 The preparation method specifically comprises the following steps:

[0097] A method for preparing transition metal chalcogenides by combining a monodisperse metal source and a CVD method. The chemical vapor deposition device is a device known in the art. The chemical vapor deposition device used in this embodiment includes a single temperature zone tube furnace, A quartz tube, wherein the quartz tube is 1.4 m long and 1 inch in diameter.

[0098] The method comprises the steps of:

[0099] (1) Take a commercially available C-face sapphire substrate (purchased from Suzhou Yancai Micro-Nano Technology Co., Ltd.) (the atomic force microscope characterization of the unannealed sapphire substrate is as follows Figure 1a shown), cut into small pieces of 1cm×1cm, ultrasonically cleaned with acetone, absolute ethanol, and deionized water for 10 minutes each to obtain a substrate with a clean surface, annealed in a muffle fu

Embodiment 2

[0106] This embodiment provides an absolute single-layer MoS 2 The preparation method of described monodisperse substrate preparation device and chemical vapor deposition device are identical with embodiment 1, and the difference of described method and embodiment 1 is:

[0107] In step (2), 0.006181 g of ammonium molybdate (purchased from Aladdin Reagents) was weighed, dissolved in a mixed solvent of 4 mL of deionized water and 6 mL of absolute ethanol, and heated and stirred at 90°C for 1 h.

Embodiment 3

[0109] This embodiment provides an absolute single-layer MoSe 2 The preparation method of described monodisperse substrate preparation device and chemical vapor deposition device are identical with embodiment 1, and the difference of described method and embodiment 1 is:

[0110] In step (2), 0.006181g of ammonium molybdate (purchased from Aladdin Reagents) needs to be weighed, dissolved in a mixed solvent of 4mL deionized water and 6mL absolute ethanol, heated and stirred at 90°C for 1h;

[0111] Step (5) is to place 80mg of Se powder and the substrate obtained in step (4) successively in a quartz tube with a diameter of 1 inch according to the airflow direction, and the distance between the sapphire substrate and the Se powder is 18cm, wherein the sapphire substrate is placed in the tube The location of the central temperature zone of the furnace;

[0112] In step (6), heating is performed until the temperature of the place where the sapphire substrate is placed reaches 900° C

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Abstract

The invention relates to a preparation method and application of a wafer-level absolute single-layer transition metal chalcogenide. The preparation method comprises the following steps that (1) first annealing treatment is carried out on a sapphire substrate to obtain a sapphire substrate with an atomic-scale flat surface; (2) a transition metal salt solution is loaded on the atomic-scale flat surface of the sapphire substrate obtained in the step (1), and secondary annealing treatment is carried out to obtain a sapphire substrate loaded with a monodisperse transition metal source; and (3) the transition metal chalcogenide is grown on the sapphire substrate loaded with the monodisperse transition metal source through a chemical vapor deposition method. A two-dimensional material prepared by the method is an absolute single layer, batch preparation on wafer-level (two inches, four inches, eight inches and twelve inches) sapphire substrates can be realized, the crystal quality is high, the single crystal size is large, the operation is simple, the cost is low, and industrialization is easy.

Description

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Claims

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Application Information

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Owner NORTHWESTERN POLYTECHNICAL UNIV
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