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43 results about "Single crystal" patented technology

A single crystal or monocrystalline solid is a material in which the crystal lattice of the entire sample is continuous and unbroken to the edges of the sample, with no grain boundaries. The absence of the defects associated with grain boundaries can give monocrystals unique properties, particularly mechanical, optical and electrical, which can also be anisotropic, depending on the type of crystallographic structure. These properties, in addition to making them precious in some gems, are industrially used in technological applications, especially in optics and electronics.

Method and apparatus for preparing major diameter single crystal

InactiveCN1847468AMake up for heat lossHigh Inductive Heat InputPolycrystalline material growthBy zone-melting liquidsSingle crystalEngineering
The present invention relates to an apparatus and method for growing a high melting point single crystal having a predetermined orientation, which is grown from a culture rod (3) by a floating zone method or a suspension zone method. The device comprises: culture rods (3) and crystal nuclei (4), a strip-shaped resistance heating type heating strip (6) provided with at least one opening is installed between its ends and next to it, and it is heated To the crystal melting temperature, so as to form the melting zone (5), drive mechanism (8, 11), so that relative movement occurs between the heating belt (6) and the crystal nucleus (4) and the culture rod (3) that are installed next to the heating belt , the molten liquid material of the culture rod (3) is obtained through each opening of the heating belt, and causes single crystal growth on the crystal nucleus (4) by cooling, and another heating device (15, 16), which is arranged at the melting The vicinity of the zone (5) in order to set the temperature gradient within the range of the melting zone (5). In order to reduce the temperature gradient in the melting zone, said further heating device (15, 16) comprises at least one heating coil (17, 19), which is driven with radio frequency, wherein the heating strip (6) and the respective heating coil are thus mounted opposite each other (17, 19) so that radio frequency radiation is coupled on the heating strip in order to generate an additional inductive heat input in the heating strip and to set a temperature gradient across the melting zone (5). This enables an inductive heat input into the heating strip, which can be varied or varied in a targeted manner.
Owner:SCHOTT AG

Silver nano lattice surface enhanced raman active substrate and preparation method thereof

InactiveCN102590179AUniform shapeOptimal Control StructureRaman scatteringNanotechnologyNanodotSingle crystal
The invention discloses a silver nano lattice surface enhanced raman active substrate and a preparation method thereof. According to the substrate, silicon single crystal is used as an underlay; a silver nanoparticle array structure is deposited on the silicon surface; the particle size of the silver nanoparticles is 30-90 nm; and the center distance of the particles is 99-111 nm. The silver nano lattice surface enhanced raman active substrate provided by the invention has a uniform shape and a controllable structure, and has an obvious surface raman enhancement effect on analytes of different concentrations, and an enhancement signal is uniform and stable. According to the method, the structural parameters and the shape of a silver nano lattice can be adjusted according to structural parameters of an ultra-thin aluminum oxide template, so that different influences of different metal nano lattice substrates on a raman surface enhancement effect are realized. The substrate and the method have the advantages of easiness for operation, low cost and easiness for industrial production.
Owner:SHANGHAI UNIV

Pt Ni Al bonding layer doped with binary trace active elements and capable of being completely oxidation resisting at 1200 DEG C and preparation method thereof

ActiveCN103966615AImproved high temperature oxidation resistanceImprove high temperature oxidation resistanceVacuum evaporation coatingSputtering coatingElectron beam physical vapor depositionGas phase
The present invention discloses a Pt Ni Al bonding layer doped with binary trace active elements and capable of being completely oxidation resisting at 1200 DEG C and a preparation method thereof and belongs to the field of novel thermal barrier coatings and the preparation technologies. According to the invention, firstly, a Pt layer with the thickness of 5-10 microns is prepared on a nickel base monocrystal high temperature alloy matrix through the plating or the electron beam physical vapor deposition method, and then a NiAlHfZr coating with the thickness of 20-60 microns is deposited on the Pt layer through the electron beam physical vapor deposition method. The Pt layer reduces the interfacial holes and effectively improves the adhesion of an oxidation film; binary doping of Hf, Zr enables the NiAl coating surface to be smoother and denser and enables the oxidation film generated during the oxidation process on the coating surface to be straighter, especially with little oxidation increase, and greatly improves the oxidation resistance of the coating. The Pt Ni Al bonding layer is completely oxidation resisting at 1200 DEG C. The service life of the coating is prolonged to certain degree through doping of binary elements namely Hf and Zr and Pt modification.
Owner:BEIHANG UNIV

Single crystal pulling device, preparation method of single crystal silicon and single crystal silicon

InactiveCN109554756APrevent inflowReduce dislocationPolycrystalline material growthUnder a protective fluidSingle crystalEngineering
Embodiments of the present invention provide a single crystal pulling device, a preparation method of single crystal silicon, and the single crystal silicon. The single crystal pulling device includesa housing, a melting member and a blocking member; the housing is provided with a receiving space, the receiving space includes at least a first chamber and a second chamber communicating with the first chamber, and the second chamber is located above the first chamber; the melting member is used for heating and melting polysilicon, and the melting member is fixed to the bottom of the first chamber; and the blocking member is located in the second chamber, and the blocking member is used for injecting an inert gas in a preset manner to prevent impurities generated by the polysilicon melting process from entering the upper chamber of the second chamber. With the single crystal pulling device disclosed by the embodiments of the invention, a large amount of impurities can be prevented from flowing into the upper chamber of the single crystal pulling device, thereby reducing the dislocation problem of a single crystal silicon rod caused by impurities, improving the crystal quality, and also facilitating the cleaning work of the receiving space.
Owner:XIAN ESWIN SILICON WAFER TECH CO LTD

Method for reducing content of carbon in single crystal bar

ActiveCN109097822APrevent fallingAvoid enteringPolycrystalline material growthBy pulling from meltLower limitCrucible
The invention discloses a method for reducing content of carbon in a single crystal bar. The method specifically comprises steps as follows: (1) a thermal field below a liquid level is mounted at thelower end of a furnace tube; (2) a material block is put in a crucible by means of a hoisting procedure, material protecting cloth is uniformly spread, wherein traction wires are uniformly arranged onone surface of the material protecting cloth, all the traction wires are connected together through a traction wire guide block, the traction wire guide block is arranged in the center of the material protecting cloth, the surface without traction wires completely covers the material blocks put in the crucible, and the crucible is descended to the lower limit position in the furnace tube and located at the upper end of the thermal field below the liquid level; (3) a thermal field above the liquid level is mounted, and the furnace tube is started to be closed after mounting; (4) after the furnace tube is closed, the traction wire guide block is lifted upwards, the material protecting cloth is directly taken out, and the furnace is continuously closed; (5) after the tube is closed, the material protecting cloth is turned over in the designated position of a workshop, so that lifted graphite powder and other impurities are lifted, then, the material protecting cloth is blown clean on thewhole with a blower, and the material protecting cloth and a sucker are transported to a charging chamber.
Owner:BAOTOU MEIKE SILICON ENERGY CO LTD

Method for preparing cubic boron nitride single crystal-film homogeneous P-N junction

InactiveCN101807519AReduce processing difficultyIncrease productivitySemiconductor/solid-state device manufacturingDiffusion methodsSynthesis methods
The invention relates to a method for preparing cubic boron nitride (cBN) single crystal-film homogeneous P-N junction, and belongs to a method for preparing semiconductor components. The method comprises the steps of: synthesizing a semiconducting cBN single crystal with semiconductor characteristic and preparing a doped cBN film, wherein the cBN film has the semiconductor characteristic opposite to that of the cBN single crystal; the semiconducting cBN single crystal with the semiconductor characteristic is synthesized by a high-pressure direct synthesis method or a high-pressure re-diffusion method; and the doped cBN film is prepared by taking the semiconducting cBN single crystal with the semiconductor characteristic as a substrate and doping and growing a cBN film with a semiconductor type opposite to a substrate type by a vacuum vapor deposition method. The vacuum vapor deposition method is a vacuum physical vapor deposition method or a vacuum chemical vapor deposition method. The method has the advantages of reduction in processing difficulties, improvement on production efficiency, yield and the like and great improvement compared with the conventional technology for preparing a cBN homogeneous P-N junction by high-pressure systemization and re-growth processes.
Owner:JILIN UNIV

Graphite disc turnover type GaN single crystal substrate laser pre-stripping integrated cavity

PendingCN111778559AAchieve heat preservationReduced growth quality issuesPolycrystalline material growthFrom chemically reactive gasesSingle crystal substrateSingle crystal
The invention discloses a graphite disc turnover type GaN single crystal substrate laser pre-stripping integrated cavity. A heat preservation tray containing a phase change material is adopted to achieve heat preservation of a graphite disc, the temperature of the heat preservation tray can be kept at 700 DEG C or above within a certain period of time, the probability of growth quality problems caused by sudden temperature change or too low temperature of a GaN single crystal substrate slice is remarkably reduced, and the growth quality of GaN single crystals is improved; the integrated chamber is connected with the HVPE equipment, a certain vacuum degree or inert gas filling can be achieved in the chamber, the heating and heat preservation functions are achieved, the environment atmosphere of the GaN single crystal substrate slice in the whole transfer process can be guaranteed, and the growth quality of the GaN single crystal substrate in the subsequent process is guaranteed; the transfer tray with the heat preservation function is adopted to transfer the GaN single crystal substrate slices in the heat preservation tray in the integrated cavity in a full-disc mode, the sapphire substrate faces of all the GaN single crystal wafers face upwards, and therefore the Bernoulli adsorption transmission mode can be canceled, and the laser pre-stripping efficiency of the GaN single crystal substrate slices can be remarkably improved.
Owner:GENERAL ENG RES INST CHINA ACAD OF ENG PHYSICS

Novel production method of 8-inch zone-melting silicon single crystal for IGBT (insulated gate bipolar transistor)

InactiveCN106011997AIncrease crystallization rateReduce manufacturing costPolycrystalline material growthBy zone-melting liquidsMicrowaveSemiconductor materials
With rapid development of various industries in modern society, semiconductor materials are applied to various aspects such as application of energy and power systems, development of the information industry, a microelectronic technique, a microwave electronic technique, a photoelectronic technique, a power electronic technology, a sensor technique and the like; with successive starting of national key large and ultra-large water conservancy, thermal power generation engineering, metro, light railways and railroad engineering and with rise of the newly-developing IGBT (insulated gate bipolar transistor) industry, the problems of insufficient production capacity of zone-melting silicon single crystals, particularly, large-diameter 8-inch zone-melting silicon single crystals and relative lack of processes are highlighted. Production of the 8-inch zone-melting silicon single crystals is mainly based on manual operation control on single crystal growth. The production method of the 8-inch zone-melting silicon single crystal for an IGBT is stressed and explained from the manual production and power method, power output stability, single crystal growth angles and the like to solve the problem about the shape of the single crystal in the growth process of the 8-inch zone-melting silicon single crystal.
Owner:BEIJING TIAN NENG YUN TONG CRYSTAL TECH CO LTD

Two-dimensional organic-inorganic hybrid double perovskite semiconductor crystal and preparation method and application thereof

ActiveCN114686987AApparent photoconductive effectPolycrystalline material growthFrom normal temperature solutionsSemiconductor materialsPhotoconductive detector
The invention relates to a two-dimensional organic-inorganic hybrid double perovskite semiconductor crystal and a preparation method and application thereof. The invention relates to an organic-inorganic hybrid double perovskite semiconductor crystal. The chemical formula of an inorganic-organic hybrid semiconductor material is (C6H5CH2NH3) 4AgBiBr8. According to the invention, the organic-inorganic hybrid double-perovskite semiconductor crystal is prepared, and the organic-inorganic hybrid double-perovskite semiconductor crystal is prepared into a planar photoconductive detector, so that high-sensitivity detection of an intrinsic absorption spectrum can be realized. Laser with the wavelength of 405 nm is used for irradiating the single crystal detector, and the photoelectric response of the single crystal detector is tested. When the power density of incident light is 50.9 mW / cm < 2 >, the crystal device shows an obvious photoconductive effect, and the ratio of light current to dark current can reach 1.8 * 10 < 3 >. The result shows that the material has potential application value when being used as a photoconductive detector.
Owner:FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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