Edge-emitting semiconductor laser chip testing method and system
A chip testing and semiconductor technology, applied in the direction of electronic circuit testing, instruments, measuring electronics, etc., can solve problems affecting production efficiency, high production cost of equipment, large equipment footprint, etc., to reduce handling time, improve testing efficiency, The effect of reducing the footprint
Pending Publication Date: 2021-11-02
武汉云岭光电有限公司
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Problems solved by technology
At present, after all edge-emitting semiconductor laser wafers are manufactured, back-end processes such as cleavage, coating, and disassembly are required to obtain a single chip, and each chip needs to be tested and screened for optoelectronic performance. Therefore, each chip The time cost of testing has become one of the main bottlenecks in the back-end of chip production
From the point of view of the conventional test system, each chip to be tested needs to be transported to the test platform through the suction nozzle for alignment test, and then placed in bins according to the program setting and test results. Chips take up a lot of time for chip testing, affecting production efficiency
[0003] For the traditional test system, it is generally equipped with 2 test platforms with different temperatures, and with 2 to 3 suction nozzles to carry the module; this structure can only be used in the loading area, test station 1, and test station 2 at the same time. , Handling between two stations in the unloading area, spending a lot of time on chip handling
[0004] Secondly, the traditional test system generally adopts a parallel structure, that is, the loading area, the test station 1, the test station 2, and the unloading area are distributed horizontally, and the equipment will be equipped with two or more motors to drive the suction nozzle movement. , this parallel structure leads to a larger footprint of the equipment, the use of multiple motors and a large equipment area cause the equipment to have a higher manufacturing cost
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[0029] Next, the technical solutions in the embodiments of the present invention will be described in connection with the drawings of the embodiments of the present invention, and it is understood that the described embodiments are merely the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, those of ordinary skill in the art will belong to the scope of the present invention in the scope of the present invention without making creative labor premises.
[0030] See Figure 1 to 6, Embodiments provide a mechanism for feeding the edge-emitting semiconductor laser chip test system, comprising a feeding zone, a lower zone, a test zone and a reclaiming mechanism, said test zone comprising a plurality of test stage, the present invention includes a plurality of take and a reclaimer for driving each head of the pick head rotating shaft 19, the upper feed zone, the lower feed zone of each of the test stage and encircling the sh
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The invention relates to an edge-emitting semiconductor laser chip testing system, which comprises a feeding area, a discharging area, a testing area and a material taking mechanism. The testing area comprises a plurality of testing carrying tables, the material taking mechanism comprises a plurality of material taking heads and a rotating shaft used for driving the material taking heads to rotate, and the feeding area, the discharging area and the testing carrying tables are arranged around the rotating shaft. The surrounding direction of the feeding area, the discharging area and all the testing carrying tables is consistent with the rotating direction of the rotating shaft, all the testing carrying tables are located on the surrounding path between the feeding area and the discharging area, the number of the feeding area, the discharging area and all the testing carrying tables is the same as the number of all the material taking heads, and the feeding area, the discharging area and all the testing carrying tables are arranged in a one-to-one correspondence mode. The invention provides an edge-emitting semiconductor laser chip testing method. By means of the surrounding type layout, the actions of feeding, testing and discharging can be completed through rotation of the rotating shaft, excessive bypassing operation paths are avoided, the size of the system is greatly reduced, and the occupied area is reduced; and chips are synchronously carried, so that the chip carrying time is greatly shortened.
Description
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