Device and method for testing bonding strength of interlayer soft material

A technology of bonding strength and soft matter, applied in the direction of measuring devices, mechanical devices, instruments, etc., can solve the problems of low efficiency, waste, inconvenient bonding test, etc., to improve efficiency, simple structure, improve efficiency and accuracy sexual effect

Pending Publication Date: 2022-03-25
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Regarding the adhesion test in this aspect, it is currently a destructive test. If the packaged product is directly subjected to a destructive test,

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example 2, a method of testing a soft material bonding intensity between test layers, including the following steps:

[0031] Step 1: Apply the material to be tested on the surface of the two test plate 6 to form a sandwich structure in the form of a test pressure plate 6 / to be tested. The material of the test pressure plate 6 is the same as the material of the existing electronic product, for example, as in the package cover, the material of the substrate, can be tested to be tested with the encapsulation cover, the adhesive force between the substrates. The material 7 can be not limited to a soft material or a mixture. The thickness of the test material can be freely adjusted according to the specific test requirements.

[0032] Step 2: The other side of the two test pressure plates 6 is fixed to the bonding plate 3 of a pair of test fixtures, respectively.

[0033] Step 3: Making the test fixture on the material mechanics tester 5 for tensile strength test, administerin

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PUM

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Abstract

The invention discloses a device and a method for testing the bonding strength of an interlayer soft substance, and relates to the field of bonding force testing. Comprising a material mechanics tester, two oppositely arranged test jigs and two test pressing plates, each of the two test jigs comprises a connecting button, a universal ball head and a bonding plate which are connected in sequence, one end, far away from the universal ball head, of the connecting button of one test jig is connected with a clamp at the fixed end of the mechanical tester, and one end, far away from the universal ball head, of the connecting button of the other test jig is connected with a clamp at the tensile end of the mechanical tester; the two test pressing plates are oppositely arranged and are both located between the two oppositely-arranged test jigs, the opposite faces of the two test pressing plates are coated with a to-be-tested material, the other faces, away from the opposite faces, of the test pressing plates are connected with the bonding plate, and the material of the test pressing plates is the same as that of the to-be-tested piece. The bonding force testing device is used for testing the bonding force between the material and the to-be-tested piece, and the problems of inconvenience and low efficiency of bonding testing caused by non-uniformity of all products are solved.

Description

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Claims

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Application Information

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Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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