Bonding process between metal substrate and glass substrate

A technology for metal substrates and glass substrates, applied in the direction of surface pretreatment bonding methods, adhesives, bonding methods, etc., can solve problems such as difficult cleaning, strong odor, and inability to meet the requirements of bonding strength, and achieve enhanced bonding Force, the effect of improving the connection strength

Pending Publication Date: 2022-07-12
SUZHOU HI TECH ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This new method allows for strong connections between two materials by forming an interference layer that increases their interaction through chemical bonds or physical interactions like pressure-bonded together.

Problems solved by technology

This patented technical problem addressed by this patents relates to improving the bond quality achieved during joining metals together without causing excessive bubbles on their surface when used at high temperatures due to reactions involving liquids containing active agents like ammonia gas.

Method used

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  • Bonding process between metal substrate and glass substrate
  • Bonding process between metal substrate and glass substrate
  • Bonding process between metal substrate and glass substrate

Examples

Experimental program
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preparation example Construction

[0025] The preparation process of the adhesive film can be as follows: Weigh the thermoplastic polyurethane resin, the latent curing agent, the thickener and other auxiliary agents according to the above formula, mix them evenly to obtain a water-dispersed mixture, and add a certain amount of deionized water to adjust. The value of the solids content of the water-dispersed mixture.

[0026] Then, the water-dispersed mixture is evenly coated on the release film or release paper, and after being baked in an oven for a period of time to be completely dried, an adhesive film with a certain thickness is obtained. In a specific embodiment, the temperature of the oven may be 50° C., and the drying time may be about 10 minutes.

[0027] Another embodiment of the present invention provides a bonding process between a metal substrate and a glass substrate, which utilizes the above-mentioned adhesive film. The bonding process includes the following steps:

[0028] S1. The surface of the m

Embodiment 1

[0039] Add 100 parts of Dispercoll U58, 8 parts of Dispercoll 2516, 1.5 parts of Rheovis PU 1190, 2 parts of DYNOL 604, 1 part of BYK 333 to a 250ml plasticizing cup, and add deionized water and mix well to obtain solid content The mixture was dispersed in 48 wt% water. The above-mentioned water-dispersed mixture was evenly coated on the PE coated release paper, baked in an oven at 50° C. for 10 minutes, and after it was completely dried, an adhesive film with a thickness of 100 μm was obtained.

[0040] Plasma sputtering was performed on the stainless steel surface using a jet AP plasma treatment system with a scan rate of 1 m / min. The polymer coating selects 94Prime from 3M Company as the polymer primer. The ink coating is made of HF GV3-S from Seiko Ink.

[0041] Place the adhesive film between the polymer coating and the ink coating, remove the PE-coated release paper, then press at 100°C and 0.4Mpa pressure for 60s, then take it out and let it stand for 4h.

Embodiment 2

[0043] Add 100 parts of Dispercoll 2899, 8 parts of Dispercoll 2516, 1.5 parts of Rheovis PU 1190, 2 parts of DYNOL 604, 1 part of BYK 333 to a 250ml plasticizing cup, and add deionized water and mix well to obtain solid content The mixture was dispersed in 48 wt% water. The above-mentioned water-dispersed mixture was evenly coated on the PE coated release paper, baked in an oven at 50° C. for 10 minutes, and after it was completely dried, an adhesive film with a thickness of 100 μm was obtained.

[0044] Plasma sputtering was performed on the stainless steel surface using a jet AP plasma treatment system with a scan rate of 1 m / min. The polymer coating selects 94Prime from 3M Company as the primer. The ink coating is made of HF GV3-S from Seiko Ink.

[0045] Place the adhesive film between the polymer coating and the ink coating, remove the PE-coated release paper, then press at 100°C and 0.4Mpa pressure for 60s, then take it out and let it stand for 4h.

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Abstract

The invention discloses a bonding process between a metal base material and a glass base material, which comprises the following steps: coating the surface of the metal base material with a layer of polymer coating, coating the surface of the glass base material with a layer of ink coating, and placing a glue film between the metal base material and the glass base material, and the adhesive film is respectively combined with the polymer coating and the ink coating. According to the bonding process between the metal base material and the glass base material, hydroxyl, carboxyl and isocyanato which are contained on a main chain of thermoplastic polyurethane resin in the adhesive film respectively react with a polymer coating on the surface of the metal base material and an ink coating on the surface of the glass base material; the binding force between the adhesive film and the metal base material and the binding force between the adhesive film and the glass base material are respectively enhanced, so that the connecting strength between the metal base material and the glass base material is improved.

Description

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Claims

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Application Information

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Owner SUZHOU HI TECH ELECTRONICS CO LTD
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