Force sensor chip

[0030]Now, with reference to FIGS. 1-10, a description will be given about a force sensor chip in accordance with a first embodiment of the present invention. The instant embodiment of the force sensor chip will be described hereinbelow as being in the form of a six-axis force sensor chip, although the present invention is not limited to a six-axis force sensor chip.

[0031]FIG. 1 is a plan view showing one surface (i.e., front surface) of the force sensor chip1, and FIG. 2 shows in enlarged scale characteristic sections in FIG. 1. In FIGS. 1 and 2, there is only shown a planer shape of a base member (in this case, semiconductor substrate) 2 with illustration of strain resistance elements and wiring patterns omitted. FIG. 3 shows twelve strain resistance elements and some of electric wiring patterns and electrode pads provided on the semiconductor substrate 2 of the force sensor chip. FIG. 4 is a view, similar to FIG. 2, which shows in enlarged scale principal or relevant sections of FIG