Noise-reducing attachment apparatus for heat exchanger door of an electronics rack of a data center

a heat exchanger door and heat exchanger technology, applied in lighting and heating apparatus, electrical apparatus casings/cabinets/drawers, instruments, etc., can solve problems such as recirculation problems, difficulty in cooling, and difficulty in adjusting the approach, so as to facilitate ingress or egress and attenuate noise

Inactive Publication Date: 2009-08-13
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology provides for improved sound reduction by attaching a device called this unit between two parts that can be easily connected together without causing any issues with their functioning properly.

Problems solved by technology

The technical issue addressed in this patents relates to improving the efficiency of electronic chip systems while reducing its energy consumption during operation due to factors like space constraints on mounting hardware. Specifically, there has been a lot of research done over time trying to find ways to improve thermal management without adding extra weight beyond what's necessary when dealing with servers located closer to each other.

Method used

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  • Noise-reducing attachment apparatus for heat exchanger door of an electronics rack of a data center
  • Noise-reducing attachment apparatus for heat exchanger door of an electronics rack of a data center
  • Noise-reducing attachment apparatus for heat exchanger door of an electronics rack of a data center

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Embodiment Construction

[0034]As used herein, the terms “electronics rack”, “rack-mounted electronic equipment”, and “rack unit” are used interchangeably, and unless otherwise specified include any housing, frame, rack, compartment, blade server system, etc., having one or more heat generating components of a computer system or electronics system, and may be, for example, a stand alone computer processor having high, mid or low end processing capability. In one embodiment, an electronics rack may comprise multiple electronics subsystems, each having one or more heat generating components disposed therein requiring cooling. “Electronics subsystem” refers to any sub-housing, blade, book, drawer, node, compartment, etc., having one or more heat generating electronic components disposed therein. Each electronics subsystem of an electronics rack may be movable or fixed relative to the electronics rack, with the electronics drawers of a multi-drawer rack unit and blades of a blade center system being two examples o

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Abstract

A noise-reducing attachment apparatus for a heat exchanger door is provided for facilitating attenuation of noise emanating from an electronics rack. The apparatus includes a frame structure configured to coupled to the heat exchanger door. The door includes in air opening and air-to-liquid heat exchanger, and air passing through the air opening also passes across the heat exchanger. The air opening facilitates passage of external air through the electronics rack. The frame structure defines in part an airflow channel through the apparatus, wherein air passing through the air opening also passes through the airflow channel when the apparatus is operatively coupled to the door. An acoustically absorptive material, which is coupled to the frame structure and at least partially defines the airflow opening through the apparatus, is selected and positioned to attenuate noise emanating from the electronics rack when the apparatus is coupled to the heat exchanger door.

Description

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Claims

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Application Information

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Owner IBM CORP
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