Etching method for forming a multi-step surface on a substrate

a multi-step surface and substrate technology, applied in the field of etching methods using photoresist, can solve the problems of affecting the quality of photoresist, increasing the overall cost, and complication of the manufacture process flow, so as to reduce the production cost, simplify the manufacturing process, and reduce the alignment problem and lead time

Inactive Publication Date: 2010-01-07
SAE MAGNETICS (HK) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The technical effect that this new technology allows for more precise control over how deep an individual layer (material) needs be removed during fabrication compared to previous methods like chemical mechanical polishing techniques used beforehand. This results in improved efficiency and productivity by reducing costs associated with each step's cleanup steps afterward.

Problems solved by technology

This patented describes how to improve the efficiency and accuracy of creation of surfaces onto materials such as silicone rubber or polyimide films during the formation of multilayer structures called photosensitive layers. However, current methods have limitations due to their complexity and long processing cycles required.

Method used

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  • Etching method for forming a multi-step surface on a substrate
  • Etching method for forming a multi-step surface on a substrate
  • Etching method for forming a multi-step surface on a substrate

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Embodiment Construction

[0040]Various preferred embodiments of the invention will now be described with reference to the figures, wherein like reference numerals designate similar parts throughout the various views. As indicated above, the invention is directed to an etching method for forming a multi-step surface on a substrate, which is capable of simplifying the manufacturing process and reducing the cost.

[0041]Referring to FIG. 2, the deeper layer represents a negative photo-resist, while the shallower one represents a positive photo-resist. Taken two layers of photo-resists as an example, a preferred embodiment of the etching method according to the present invention is described in detail as followed.

[0042]Firstly, provide a substrate 200, which can be a wafer to be etched, a semiconductor substrate, or an incomplete semiconductor device. Then coat a first photo-resist layer 201 formed by positive photo-resist on a predetermined surface of the substrate 200 and bake the first photo-resist layer 201 to p

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Abstract

An etching method for forming a multi-step surface on a substrate includes: (1) coating a first photo-resist layer on a predetermined surface of the substrate; (2) coating a second photo-resist layer on the first photo-resist layer, the second photo-resist layer having a characterization opposite to that of the first photo-resist layer; (3) exposing the second photo-resist layer through a first mask so as to form a first removal region; (4) developing the second photo-resist layer to remove the first removal region; (5) exposing the first photo-resist layer through a second mask so as to form a second removal region; (6) developing the first photo-resist layer to remove the second removal region; and (7) etching the predetermined surface of the substrate and the multi-step pattern to form a multi-step surface on the substrate. The present invention also discloses an etching method for forming features on an ABS of a slider.

Description

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Claims

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Application Information

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Owner SAE MAGNETICS (HK) LTD
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