Semiconductor structures provided within a cavity and related design structures

[0018]The invention relates to semiconductor structures and methods of manufacture and, more particularly, to structures provided within a cavity, methods of manufacture and design structures. In embodiments, the structures can be, for example, Micro-Electro-Mechanical System (MEMS) structures, accelerometers, filters, oscillators, resonators, acoustic wave devices, etc., any of which can be provided within a sealed cavity structure. Advantageously, the methods of forming the structures of the present invention significantly reduce material variability on the structure, e.g., MEMS beam, itself. In one example, the reduction of material variability on the beam solves many of the issues which have now been found to exist with MEMS structures, including, for example, providing the following advantages:

[0019](i) stabilizing pull-in voltage issues and Cmin;

[0020](iii) preventing inadvertent actuation of the MEMS structure, upon the application of an RF signal;

[0021](iii) significantly reduc