System and Method for Calibrating Temperatures Sensor for Integrated Circuits

a technology of temperature sensor and integrated circuit, which is applied in the field of stackable die module, can solve the problems of slow thermal equilibrium between soc package and ambient temperature, large equilibration time, etc., and achieve the effect of large thermal time constant contrast and efficient calibration of integrated circuit temperature sensor

Active Publication Date: 2015-04-30
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a way to make it easier to calibrate temperature sensors used in electronic devices. It involves quickly measuring the temperature at different points within the device's chip or packaging. By comparing this measurement with previous measurements, the manufacturer can determine if they are working correctly.

Problems solved by technology

This patent describes conventional techniques used to calibrate temperature sensors on electronic devices such as processors or chipsets. These techniques involve correlating the sensor's output with specific temperature settings to produce a calibration curve. However, these traditional methods are slow and require significant amounts of power during each calibration cycle. Additionally, they may result in an uneven temperature distribution across different parts of the device being tested.

Method used

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  • System and Method for Calibrating Temperatures Sensor for Integrated Circuits

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Embodiment Construction

[0018]This specification includes references to “one embodiment” or “an embodiment.” The appearances of the phrases “in one embodiment” or “in an embodiment” do not necessarily refer to the same embodiment. Particular features, structures, or characteristics may be combined in any suitable manner consistent with this disclosure.

[0019]FIG. 1 depicts an embodiment of flow chart representing a method 100 for calibrating integrated circuit temperature sensors. The method may include sensing 110 a first temperature using a first temperature sensor. The method may include sensing 120 a second temperature using a second temperature sensor.

[0020]The first temperature sensor may be calibrated prior to invoking the method of FIG. 1, and may be external to a package of the integrated circuit. The first temperature sensor may have been previously calibrated to sense temperatures accurately within predetermined acceptable limits. In some embodiments, the first temperature sensor may be coupled to a

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Abstract

In some embodiments, a method may be provided for calibrating integrated circuit temperature sensors. The method may include sensing a first temperature using a first temperature sensor and a second temperature using a second temperature sensor. The first temperature sensor may be calibrated and is external to a package of the integrated circuit. The second temperature sensor may be included in the integrated circuit. The method may include increasing a temperature of the integrated circuit. The method may include allowing the integrated circuit and the package to thermally equilibrate over a first period of time. The method may include sensing a first slope of a temperature decay by the first temperature sensor. The method may include sensing a second slope of a temperature decay by the second temperature sensor. The method may include calibrating the second temperature sensor responsive to a difference between the first and second temperatures and the first and second slopes.

Description

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Claims

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Application Information

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Owner APPLE INC
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