Substrate container with enhanced flow field therein

a technology of flow field and substrate, applied in the field of substrate containers, can solve the problems of reducing the number of substrates to be stored, weak or even stalling gas current above the first piece of substrate, and remaining moisture, dust and residual heat on the surface of the substrate, etc., and achieves enhanced flow field and enhanced flow field in the box.

Pending Publication Date: 2022-03-24
GUDENG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a substrate container with enhanced flow field. The container includes a box with an internal receiving space and a bottom panel. An offset inflation mechanism is positioned outside the internal receiving space and has a gaseous chamber extending in the same direction as the bottom panel. Gas diffusion mechanisms are also present and include a base, a partition wall, and at least one diffusion member. The gas diffusion mechanism is positioned adjacent to the back panel and includes a first gas channel and a second gas channel. The invention provides a strong gaseous current that flows from behind the box to the front cover, thereby improving the flow field in the container and taking away remaining moisture, dust, and residual heat while maintaining the quality of the substrates. The offset inflation mechanism and gas diffusion mechanism do not take up substrate storage space.

Problems solved by technology

Furthermore, the odds are that remaining moisture, dust and residual heat may exist on the surfaces of the substrates processed and stored in a substrate container.
However, the gas flow field is mostly present in the vicinity of the bottom of the substrate container, but the gas current above the first piece of substrate is very weak or even stalls.
The resultant reduction in the available storage space of the substrate container causes a decrease in the number of substrates to be stored in the substrate container, leading to elevated substrate storage cost.

Method used

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first embodiment

[0025]Referring to FIG. 1, in the present disclosure, a substrate container 100 with enhanced flow field therein comprises a box 1, at least one offset inflation mechanism 2 and at least one gas diffusion mechanism 3.

[0026]The box 1 has a front cover 11, a back panel 12 opposing the front cover 11, a bottom panel 13 connecting the front cover 11 and the back panel 12, and a top panel 14 connecting the front cover 11 and the back panel 12. The box 1 further has a plurality of lateral panels (not shown). The front cover 11, the back panel 12, the bottom panel 13 and the top panel 14 define an internal receiving space S.

[0027]Referring to FIG. 1 through FIG. 3 (FIG. 3 omits the back panel 12), an offset inflation mechanism 2 is disposed outside the internal receiving space S. The offset inflation mechanism 2 has a gaseous chamber 21 extends in the same direction as the bottom panel 13. One end of the gaseous chamber 21 has an inlet 211. The inlet 211 and the box 1 lie on two opposing s...

third embodiment

[0042]Referring to FIG. 8, in the present disclosure, the back panel 12, the partition walls 32b and the diffusion members 33b are integrally formed (or are kept airtight by any other means). The gaps 323b penetrate the partition walls 32b but are not disposed between the partition walls 32b. The pressurized gas exits the first gas channel 321b and enters the second gas channel 322b via the gaps 323b. Then, the pressurized gas flows to the front cover through the through holes 331b of the diffusion members 33b. The gaps 323b are made of a porous material.

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Abstract

A substrate container with enhanced flow field therein includes a box, at least one offset inflation mechanism and at least one gas diffusion mechanism. The offset inflation mechanism is disposed outside internal receiving space of the box. The offset inflation mechanism has a gaseous chamber extending in the same direction as a bottom panel. The gas diffusion mechanism includes a base, a partition wall and at least one diffusion member. The base masks an outlet of the gaseous chamber to form an auxiliary gaseous chamber. The partition wall extends perpendicularly to the bottom panel to form a vertical first gas channel in communication with the auxiliary gaseous chamber. The diffusion member and the partition wall together define a second gas channel. The partition wall has at least one gap whereby the first gas channel and the second gas channel are in communication with each other.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This non-provisional application claims priority under 35 U.S.C. § 119(e) on U.S. provisional Patent Application Ser. No. 63 / 081,902 filed on Sep. 22, 2020, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION1. Field of the Invention[0002]The present disclosure relates to substrate containers, and in particular to a substrate container with enhanced flow field therein.2. Description of the Related Art[0003]In the manufacturing field, substrates (for example, wafers, glass substrates, circuit boards, or substrates of any other types) undergo multiple processes and are placed in a substrate container for the purpose of storage and transportation during intervening time periods. Thus, cleanliness of substrate containers is important. Furthermore, the odds are that remaining moisture, dust and residual heat may exist on the surfaces of the substrates processed and stored in a substrate container. Relat...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/677H01L21/67B65D47/32
CPCH01L21/67742H01L21/67017B65G2201/0235B65D2205/02B65G2201/0297B65D47/32H01L21/6732H01L21/67383H01L21/67376H01L21/67386H01L21/67393B65D85/48B65D81/18H01L21/67309H01L21/67373H01L21/67346B65D25/107B65D21/0204B65D21/0213B65D21/0228B65D21/083
Inventor CHIU, MING-CHIENSHEN, EN-NIENPAN, YUNG-CHINLIN, CHIH-MINGLIU, WEI-CHIENCHUNG, CHENG-ENLEE, PO-TINGJIANG, JYUN-YAN
Owner GUDENG PRECISION IND CO LTD
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