The invention discloses a device for measuring a heat
exchange coefficient of an interface between a high-temperature steel plate and a die in a hot stamp process. The device comprises a pressure applying device and a
measurement device, wherein the pressure applying device comprises a pressurization device, an upper
workbench and a lower
workbench, wherein the pressurization device is connected with the upper
workbench and the lower workbench respectively; the
measurement device comprises an upper fixture, a lower fixture and a
test sample fixing fixture; the upper fixture is fixed on the upper workbench; the lower fixture is fixed on the lower workbench; and the
test sample fixing fixture is arranged between the upper fixture and the lower fixture. The invention also discloses a method for measuring the heat
exchange coefficient of the interface between the high-temperature steel plate and the die in the hot stamp process. By the device and the method, the limitation to samples with the thickness being more than 30mm in the prior art is avoided; the heat
exchange coefficient of the interface between the steel plate and the die in the hot stamp process can be measured; and by an
elastic energy storage element, stabilization of interface pressures between a
boron steel
test sample and an upper die and between the
boron steel test sample and a lower die can be guaranteed.